Patentable/Patents/US-11523649
US-11523649

Garment pattern optimization system and method

PublishedDecember 13, 2022
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

According to an embodiment, the invention relates to a computer implemented method for grading a pattern from a first size to a second size, the pattern comprising one or more panels, the method comprising the steps of a representation step comprising representing each panel of the one or more panels by a contour, wherein a contour comprises one or more segments, a constraint step comprising imposing constraints on segments for grading to the second size; generating a mesh of each panel of the one or more panels thereby obtaining a first set of meshes; combining the first set of meshes with the constraints into a system of equations; solving the system of equations into a second set of meshes, wherein the contours of the second meshes correspond to the pattern in the second size and representing the contours of the second set of meshes.

Patent Claims
4 claims

Legal claims defining the scope of protection, as filed with the USPTO.

2

2. The computer implemented method according to claim 1, wherein the determining the one or more contours of the second set of meshes further comprises approximating the one or more contours by parametric curves.

4

4. The computer implemented method according to claim 3, wherein the one or more contours of the one or more panels are represented by parametric curves comprising the one or more characteristic points.

9

9. The computer implemented method according to claim 1, wherein the solving the system of equations into the second set of meshes further comprises minimizing a deformation energy of the second set of meshes with respect to the first set of meshes.

10

10. The computer implemented method according to claim 1, wherein the solving the system of equations into the second set of meshes further comprises morphing the first set of meshes into the second set of meshes.

Classification Codes (CPC)

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Patent Metadata

Filing Date

December 6, 2018

Publication Date

December 13, 2022

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