A power electronics submodule for mounting on a cooling device, has first and second surface sections next to one another, a substrate with a housing and includes a connection element, conductively connected by a contact to a track of the substrate and a connection section, arranged parallel to the substrate, the substrate arranged on the first surface section, the housing has a housing section, with a first main surface, arranged on the second surface section, and a second main surface, situated opposite the first main surface. In a non-mounted state a first main surface of the connection section is a first distance from the second main surface of the housing section in the housing region of a fastening device.
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February 12, 2021
December 20, 2022
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