A cooling arrangement for an electronic device comprises a primary cooling device and a secondary cooling device. The primary cooling device includes a fluidic input line receiving a cooling fluid from a cooling fluid source and a fluidic output line returning the cooling fluid toward a drain. The primary cooling device is thermally connected to the electronic device, receives the cooling fluid from the fluidic input line and transfers heat from the electronic device to the cooling fluid before returning the cooling fluid via the fluidic output line. A flow detection device monitors a flow of the cooling fluid in the primary cooling device. The secondary cooling device is thermally connected to the electronic device. A processor activates the secondary cooling device to absorb and dissipate heat from the electronic device when the flow detection device detects a lack of flow of the cooling fluid in the primary cooling device.
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2. The cooling arrangement of claim 1, wherein the secondary cooling device comprises at least one heat pipe having an evaporator portion adapted to be thermally connected to the electronic device and a condenser portion thermally connected to a heat sink.
This invention relates to cooling arrangements for electronic devices, specifically addressing the challenge of efficiently dissipating heat generated by such devices to maintain optimal operating temperatures. The arrangement includes a primary cooling device and a secondary cooling device. The primary cooling device is designed to remove heat from the electronic device, while the secondary cooling device further enhances cooling performance. The secondary cooling device comprises at least one heat pipe, which includes an evaporator portion thermally connected to the electronic device and a condenser portion thermally connected to a heat sink. The heat pipe facilitates the transfer of heat from the evaporator portion, where it absorbs heat from the electronic device, to the condenser portion, where the heat is dissipated into the heat sink. This two-stage cooling approach ensures effective heat management, particularly in high-performance or high-density electronic systems where thermal loads are significant. The use of a heat pipe in the secondary cooling device allows for efficient heat transfer over distances, making it suitable for applications where the heat sink may be located remotely from the electronic device. The arrangement is adaptable to various electronic devices, including but not limited to processors, power electronics, and other heat-generating components.
3. The cooling arrangement of claim 2, wherein the evaporator portion of the at least one heat pipe is adapted to be mounted on the primary cooling device.
A cooling arrangement for electronic systems addresses the challenge of efficiently dissipating heat from high-performance components. The system includes at least one heat pipe with an evaporator portion and a condenser portion. The evaporator portion is designed to be mounted on a primary cooling device, such as a heat sink or cold plate, to facilitate heat transfer. The heat pipe operates by absorbing heat at the evaporator portion, where a working fluid vaporizes, and then releasing the heat at the condenser portion, where the vapor condenses back into liquid. This phase-change process enables efficient heat transport over distances. The primary cooling device further enhances heat dissipation by spreading or transferring the heat to a secondary cooling medium, such as air or liquid. The arrangement ensures effective thermal management for components generating significant heat, improving reliability and performance. The design may include multiple heat pipes or additional cooling features to optimize heat transfer in compact or high-power applications.
4. The cooling arrangement of claim 2, wherein the heat sink comprises a thermoelectric cooling element activable by the processor.
A cooling arrangement for electronic devices addresses the problem of excessive heat generation, which can degrade performance and reliability. The arrangement includes a heat sink thermally coupled to a processor, where the heat sink is designed to dissipate heat generated by the processor. The heat sink incorporates a thermoelectric cooling element, which can be activated by the processor to enhance cooling efficiency. The thermoelectric cooling element operates by converting electrical energy into a temperature difference, actively removing heat from the processor. This active cooling mechanism complements passive heat dissipation, allowing the system to maintain optimal operating temperatures under varying thermal loads. The processor controls the activation of the thermoelectric cooling element based on temperature feedback, ensuring adaptive cooling performance. This design improves thermal management in high-performance computing environments, extending component lifespan and maintaining stable operation.
6. The cooling arrangement of claim 1, wherein the secondary cooling device comprises a thermoelectric cooling element activable by the processor and adapted to be thermally connected to the primary cooling device.
This invention relates to cooling systems for electronic devices, particularly addressing the challenge of efficiently managing heat dissipation in high-performance computing environments. The system includes a primary cooling device, such as a heat sink or fan, and a secondary cooling device that enhances cooling performance. The secondary cooling device incorporates a thermoelectric cooling element, which is controlled by a processor to dynamically adjust cooling based on thermal demands. The thermoelectric element can be thermally connected to the primary cooling device, allowing for integrated and adaptive cooling. When activated, the thermoelectric element generates a cooling effect by transferring heat away from critical components, supplementing the primary cooling device's function. This dual-cooling approach improves thermal management, reduces overheating risks, and extends the operational lifespan of electronic devices. The processor's activation of the thermoelectric element ensures precise temperature control, optimizing energy efficiency and performance. The system is particularly useful in applications where traditional cooling methods are insufficient, such as in high-density computing or portable electronics.
7. The cooling arrangement of claim 6, wherein the thermoelectric cooling element is adapted to be mounted on the primary cooling device.
A cooling arrangement for electronic devices addresses the challenge of efficiently dissipating heat generated by high-performance components. The system combines a primary cooling device, such as a heat sink or liquid cooling block, with a thermoelectric cooling element to enhance thermal management. The thermoelectric cooling element is designed to be mounted directly on the primary cooling device, allowing for direct heat transfer between the two components. This integration enables active cooling by the thermoelectric element, which can further reduce temperatures by transferring heat away from the primary cooling device. The arrangement ensures that the thermoelectric element operates in conjunction with the primary cooling device, optimizing overall cooling performance. This dual-stage cooling approach is particularly useful in applications where passive cooling alone is insufficient, such as in high-density computing or power electronics, where maintaining optimal operating temperatures is critical for performance and longevity. The system may also include additional features, such as thermal interface materials or mounting mechanisms, to ensure efficient heat transfer and structural stability. By combining active and passive cooling methods, the arrangement provides a more robust solution for managing heat in demanding environments.
14. The cooling arrangement of claim 2, wherein the heat sink is physically separated from the electronic device by a length of the at least one heat pipe.
This invention relates to cooling arrangements for electronic devices, specifically addressing the challenge of efficiently dissipating heat from electronic components while maintaining physical separation between the heat source and the heat sink. The arrangement includes at least one heat pipe thermally coupled to an electronic device to transfer heat away from it. The heat pipe extends to a heat sink, which is physically separated from the electronic device by the length of the heat pipe. This separation allows the heat sink to be positioned in a location optimized for cooling, such as an area with better airflow or lower ambient temperatures, without being constrained by the physical proximity to the electronic device. The heat pipe may be a flexible or rigid conduit designed to efficiently transfer heat through conduction and phase change, ensuring effective cooling even when the heat sink is remotely located. The arrangement may also include additional heat pipes or cooling elements to enhance thermal management. This design is particularly useful in applications where space constraints or environmental conditions require the heat sink to be placed away from the electronic device, such as in compact electronic systems or high-performance computing environments.
15. The cooling arrangement of claim 1, wherein the cooling fluid is in a liquid state throughout the cooling fluid circuit.
This invention relates to a cooling arrangement for electronic devices, particularly addressing the challenge of efficiently dissipating heat generated by high-performance components. The system includes a cooling fluid circuit that circulates a cooling fluid to absorb and transfer heat away from the target device. The cooling fluid remains in a liquid state throughout the entire circuit, eliminating the need for phase change or vaporization, which can introduce inefficiencies and complexity. The circuit comprises a heat exchanger that extracts heat from the electronic device and a heat dissipater that releases the absorbed heat to the environment. The cooling fluid is pumped through the circuit using a fluid pump, ensuring continuous circulation. The arrangement may also include a controller to regulate the flow rate or temperature of the cooling fluid based on thermal demands. By maintaining the cooling fluid in a liquid state, the system simplifies design, reduces energy consumption, and improves reliability compared to systems requiring phase transitions. The invention is particularly useful for high-power electronics where consistent and efficient cooling is critical.
16. The method of claim 12, wherein the cooling fluid is in a liquid state throughout the cooling fluid circuit.
This invention relates to a cooling system for electronic devices, specifically addressing the challenge of efficiently dissipating heat while maintaining the cooling fluid in a liquid state throughout the entire cooling circuit. The system includes a cooling fluid circuit that circulates a liquid coolant to absorb and transfer heat away from electronic components. The circuit comprises a heat exchanger, a pump, and a fluid reservoir, all designed to ensure the coolant remains in a liquid phase, avoiding phase changes that could reduce efficiency or cause operational issues. The heat exchanger transfers heat from the coolant to a secondary cooling medium, such as air or another liquid, while the pump maintains continuous fluid flow. The reservoir stores excess coolant and compensates for thermal expansion. The system may also include sensors to monitor fluid temperature and pressure, ensuring optimal performance. By keeping the coolant in a liquid state, the system avoids the inefficiencies and complexities associated with phase-change cooling, such as condensation or vapor bubble formation, which can degrade performance or damage components. The invention is particularly useful in high-performance computing, data centers, and other applications where reliable and efficient cooling is critical.
19. The method of claim 18, further comprising turning off the electronic device in response to detecting that the electronic device meets or exceeds a critical temperature level.
An electronic device monitoring system detects and manages overheating conditions. The system continuously monitors the temperature of an electronic device, such as a smartphone, tablet, or laptop, to prevent damage from excessive heat. When the device's temperature reaches or surpasses a predefined critical threshold, the system automatically shuts down the device to avoid thermal damage. This shutdown process may include terminating active processes, disabling power-intensive components, or fully powering off the device. The system may also log temperature data and trigger alerts to notify the user of the overheating condition. By proactively responding to critical temperature levels, the system extends the device's lifespan and ensures safe operation. The method integrates with existing thermal management systems, using sensors to measure temperature and control logic to execute shutdown procedures when necessary. This approach prevents hardware degradation and potential safety hazards caused by prolonged exposure to high temperatures.
20. The method of claim 19, further comprising transferring data and operations from the electronic device to another device before turning off the electronic device.
This invention relates to a method for managing data and operations in an electronic device, particularly to ensure continuity when the device is turned off. The method addresses the problem of data loss or operational disruption when an electronic device is powered down, by transferring data and operations to another device before shutdown. The electronic device may be a computing device, such as a smartphone, tablet, or computer, that performs tasks requiring data processing or storage. The method involves detecting an impending shutdown event, such as a low battery or user-initiated power-off, and initiating a transfer of active data and ongoing operations to a secondary device. The secondary device may be another electronic device capable of receiving and continuing the transferred tasks. The transfer process ensures that the data and operations are preserved and can be resumed on the secondary device without loss or interruption. The method may also include synchronizing data between the devices to maintain consistency. This approach is useful in scenarios where uninterrupted operation is critical, such as in industrial, medical, or enterprise environments. The invention improves reliability and user experience by preventing data loss and ensuring seamless transitions between devices.
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February 7, 2020
December 20, 2022
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