A cooling arrangement for an electronic device comprises a primary cooling device and a secondary cooling device. The primary cooling device includes a fluidic input line receiving a cooling fluid from a cooling fluid source and a fluidic output line returning the cooling fluid toward a drain. The primary cooling device is thermally connected to the electronic device, receives the cooling fluid from the fluidic input line and transfers heat from the electronic device to the cooling fluid before returning the cooling fluid via the fluidic output line. A flow detection device monitors a flow of the cooling fluid in the primary cooling device. The secondary cooling device is thermally connected to the electronic device. A processor activates the secondary cooling device to absorb and dissipate heat from the electronic device when the flow detection device detects a lack of flow of the cooling fluid in the primary cooling device.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The cooling arrangement of claim 1, wherein the secondary cooling device comprises at least one heat pipe having an evaporator portion adapted to be thermally connected to the electronic device and a condenser portion thermally connected to a heat sink.
3. The cooling arrangement of claim 2, wherein the evaporator portion of the at least one heat pipe is adapted to be mounted on the primary cooling device.
4. The cooling arrangement of claim 2, wherein the heat sink comprises a thermoelectric cooling element activable by the processor.
6. The cooling arrangement of claim 1, wherein the secondary cooling device comprises a thermoelectric cooling element activable by the processor and adapted to be thermally connected to the primary cooling device.
7. The cooling arrangement of claim 6, wherein the thermoelectric cooling element is adapted to be mounted on the primary cooling device.
14. The cooling arrangement of claim 2, wherein the heat sink is physically separated from the electronic device by a length of the at least one heat pipe.
15. The cooling arrangement of claim 1, wherein the cooling fluid is in a liquid state throughout the cooling fluid circuit.
16. The method of claim 12, wherein the cooling fluid is in a liquid state throughout the cooling fluid circuit.
19. The method of claim 18, further comprising turning off the electronic device in response to detecting that the electronic device meets or exceeds a critical temperature level.
20. The method of claim 19, further comprising transferring data and operations from the electronic device to another device before turning off the electronic device.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
February 7, 2020
December 20, 2022
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