Panel level packaging (PLP) with high accuracy and high scalability is disclosed. The PLP includes dies bonded face down onto an alignment carrier configured with die bond regions. Pre-bond and post bond inspection are performed at the carrier level to ensure accurate bonding of the dies to the carrier.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The method of claim 1 wherein determining the die reference point comprises determining a plurality of die reference points.
3. The method of claim 2 wherein the plurality of die reference points are offset by a die reference point offset.
4. The method of claim 1 wherein determining the target bond position comprises determining a carrier reference point based on the local carrier fiducials.
5. The method of claim 4 wherein determining the carrier reference point comprises determining a plurality of carrier reference points.
6. The method of claim 5 wherein the plurality of carrier reference points are offset by a carrier reference point offset.
13. The system of claim 12 wherein determining the die reference point comprises determining a plurality of die reference points.
14. The system of claim 13 wherein the plurality of die reference points are offset by a die reference point offset.
15. The system of claim 12 wherein determining the target bond position comprises determining a carrier reference point based on the local carrier fiducials, wherein the carrier reference point comprises a plurality of carrier reference points.
16. The system of claim 15 wherein the plurality of carrier reference points are offset by a carrier reference point offset.
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December 30, 2020
January 10, 2023
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