A substrate processing technology including: transferring a substrate to a process chamber and mounting the substrate on a substrate holder; heating the substrate with a heating device to perform predetermined substrate processing; determining the number of times of the predetermined substrate processing that has been performed that the predetermined substrate processing has been performed a preset number of times or more, determining whether it is necessary to adjust a mounting position at which the substrate is mounted on the substrate holder; and when it is determined that a mounting position adjustment is necessary, determining the mounting position by comparing the substrate temperature measured at the performing the predetermined substrate processing with a premeasured temperature of the substrate which corresponds to the mounting position and is stored in a memory.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The method of manufacturing a semiconductor device according to claim 1, wherein the memory is configured to store sheet resistance at a predetermined position on the surface of the substrate, and the determining of whether it is necessary to adjust the mounting position comprises determining whether it is necessary to adjust the mounting position by comparing a value of the sheet resistance with a value of a reference sheet resistance measured in advance.
3. The method of manufacturing a semiconductor device according to claim 1, wherein when it is determined, in the determining of whether it is necessary to adjust the mounting position, that a temperature measured by a temperature sensor is higher or lower than an allowable temperature range stored in the memory, it is determined that an abnormality has occurred in the heating device and a subsequent process is stopped.
4. The method of manufacturing a semiconductor device according to claim 1, wherein in the determining of the mounting position of the substrate, a position at which the temperature measured by a temperature sensor is the same temperature as the premeasured temperature of the substrate at a reference position stored in the memory is determined as the mounting position of the substrate after the mounting position is adjusted.
7. The substrate processing apparatus according to claim 5, wherein when it is determined that a temperature measured by a temperature sensor is higher or lower than an allowable temperature range stored in the memory, the controller is configured to perform control to determine that an abnormality has occurred in the heating device and stop a subsequent process.
8. The substrate processing apparatus according to claim 5, wherein the controller is configured to perform control such that a position at which the temperature measured by the temperature sensor is the same temperature as the stored premeasured temperature of the substrate at a reference position is determined as the mounting position of the substrate after the mounting position is adjusted.
10. The non-transitory computer-readable recording medium according to claim 9, wherein the memory is configured to store sheet resistance at a predetermined position on the surface of the substrate, and the determining of whether it is necessary to adjust the mounting position comprises determining whether it is necessary to adjust the mounting position by comparing a value of the sheet resistance with a value of a reference sheet resistance measured in advance.
11. The non-transitory computer-readable recording medium according to claim 9, wherein when it is determined, in the determining of whether it is necessary to adjust the mounting position, that a temperature measured by a temperature sensor is higher or lower than an allowable temperature range stored in the memory, it is determined that an abnormality has occurred in the heating device and a subsequent process is stopped.
12. The non-transitory computer-readable recording medium according to claim 9, wherein in the determining of the mounting position, a position at which the temperature measured by the temperature sensor is the same temperature as the premeasured temperature of the substrate at a reference position stored in the memory is determined as the mounting position of the substrate after the mounting position is adjusted.
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September 13, 2019
January 10, 2023
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