A bumped solder pad and methods for adding bumps to a solder pad are provided. A substrate is provided having metal layer formed thereon and a solder pad formed from a portion of the metal layer. A surface treatment is applied to the solder pad. The surface treatment is patterned. The surface treatment is etched to produce at least one bump on the solder pad.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The method according to claim 1, wherein the surface treatment comprises a metal.
3. The method according to claim 1, wherein the surface treatment comprises gold.
4. The method according to claim 1, wherein the surface treatment comprises a nickel-gold alloy.
5. The method according to claim 1, wherein applying the surface treatment to the solder pad comprises electroplating metal to the solder pad.
6. The method according to claim 1, wherein additively applying the surface treatment comprises electroplating the surface treatment to the solder pad.
7. The method according to claim 1, wherein patterning the photo-resist material exposes a portion of the solder pad.
10. The solder pad according to claim 9, wherein the surface treatment comprises a metal.
11. The solder pad according to claim 9, wherein the surface treatment comprises gold.
12. The solder pad according to claim 9, wherein the surface treatment comprises a nickel-gold alloy.
13. The solder pad according to claim 9, wherein additively applying the surface treatment to the solder pad comprises electroplating metal to the solder pad.
15. The solder pad according to claim 14, wherein the surface treatment means comprises a metal.
16. The solder pad according to claim 14, wherein the surface treatment means comprises gold.
17. The solder pad according to claim 14, wherein the surface treatment means comprises a nickel-gold alloy.
18. The solder pad according to claim 14, wherein additively applying the surface treatment means to the solder pad comprises electroplating metal to the solder pad.
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June 10, 2020
January 17, 2023
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