An object of the present invention is to improve in-plane uniformity in polishing in a polishing device.A temperature adjusting device for adjusting temperature of a rotating polishing pad comprises: a heat conductor that can contact with a top face of the polishing pad; an arm for holding the heat conductor above the polishing pad; column members formed to stand on a top face of the heat conductor, comprising an upstream-side column member and a downstream-side column member arranged at a position at an upstream/downstream side of rotation of the polishing pad; and overhung members extending, from the upstream-side column member and the downstream-side column member, in directions that are parallel to the top face of the heat conductor; wherein the overhung members can contact with a top face of the arm.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The temperature adjusting device according to claim 1, wherein, when the heat conductor is in contact with the polishing pad, the overhung members are separated from the top face part of the arm tip part.
3. The temperature adjusting device according to claim 2, wherein, when the top face part of the arm tip part is in contact with the overhung members, the heat conductor is separated from the polishing pad.
5. The temperature adjusting device according to claim 1, wherein the upstream-side column member and the downstream-side column members regulate relative movement between the heat conductor and the arm in a direction parallel to the top face of the heat conductor.
6. The temperature adjusting device according to claim 1, wherein the top face part of the arm tip part comprise an elastic material.
7. The temperature adjusting device according to claim 1, wherein a part of the arm, which is in contact with the upstream-side column member or the downstream-side column member, comprises an elastic member.
8. The temperature adjusting device according to claim 1, wherein the overhung member extends in a radial direction in the polishing pad.
9. The temperature adjusting device according to claim 1, wherein, when the heat conductor is in contact with the polishing pad, a size of a space in a height direction between the overhung member and the top face part of the arm tip part at the upstream-side column member is different from a size of a space in the height direction between the overhung member and the top face part of the arm tip part at the downstream-side column member.
10. The temperature adjusting device according to claim 9, wherein, when the heat conductor is in contact with the polishing pad, the size of the space in the height direction between the overhung member and the arm at the upstream-side column member is smaller than the size of the space in the height direction between the overhung member and the arm at the downstream-side column member.
11. The temperature adjusting device according to claim 10, wherein a diameter of the upstream-side column member is larger than a diameter of the downstream-side column member.
12. The temperature adjusting device according to claim 1, further comprising a movable mechanism for moving the heat conductor upward and downward.
13. The temperature adjusting device according to claim 12, wherein the movable mechanism can move the heat conductor in a horizontal direction.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
November 22, 2019
February 14, 2023
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