A package that includes a second redistribution portion, a die coupled to the second redistribution portion, an encapsulation layer encapsulating the die, and a first redistribution portion coupled to the second redistribution portion. The first redistribution portion is located laterally to the die. The first redistribution portion is located over the second redistribution portion. The first redistribution portion and the second redistribution portion are configured to provide one or more electrical paths for the die.
Legal claims defining the scope of protection, as filed with the USPTO.
5. The package of claim 3, wherein the die is coupled to the third redistribution portion through a die attach film (DAF).
6. The package of claim 3, wherein a minimum line (L) and a minimum spacing (S) of the first plurality of interconnects, the second plurality of interconnects, and the third plurality of interconnects are in a range of 5-10 micrometers (μm)/5-10 micrometers (μm).
7. The package of claim 2, further comprising a fourth plurality of interconnects traveling through the encapsulation layer, wherein the plurality of encapsulation interconnects are coupled to the first plurality of interconnects and the second plurality of interconnects.
8. The package of claim 7, wherein the plurality of encapsulation interconnects includes pillars.
9. The package of claim 1, wherein the encapsulation layer is located between the first redistribution portion and the die.
10. The package of claim 1, wherein the package is incorporated into a device selected from a group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an internet of things (IoT) device, and a device in an automotive vehicle.
12. The package of claim 11, wherein the package is a package on package (PoP).
13. The package of claim 11, wherein the integrated device includes a die.
14. The package of claim 11, wherein the integrated device includes a second integrated device package.
16. The package of claim 15, wherein a minimum line (L) and a minimum spacing (S) of the first plurality of interconnects, the second plurality of interconnects, and the third plurality of interconnects are in a range of 5-10 micrometers (μm)/5-10 micrometers (μm).
17. The package of claim 15, further comprising a plurality of encapsulation interconnects traveling through the encapsulation layer, wherein the plurality of encapsulation interconnects are coupled to the first plurality of interconnects and the second plurality of interconnects.
18. The package of claim 17, wherein the plurality of encapsulation interconnects includes pillars.
19. The package of claim 11, wherein the encapsulation layer is located between the first redistribution portion and the die.
20. The package of claim 11, wherein the package is incorporated into a device selected from a group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an internet of things (IoT) device, and a device in an automotive vehicle.
23. The apparatus of claim 22, wherein a minimum line (L) and a minimum spacing (S) of the first plurality of interconnects and the second plurality of interconnects are in a range of 5-10 micrometers (μm)/5-10 micrometers (μm).
25. The apparatus of claim 24, wherein the die is coupled to the third means for redistribution through a die attach film (DAF).
27. The method of claim 26, wherein the back side redistribution portion and the die side redistribution portion are configured to provide one or more electrical paths for the die.
29. The method of claim 26, wherein a minimum line (L) and a minimum spacing (S) of the first plurality of interconnects, the second plurality of interconnects, and the third plurality of interconnects are in a range of 5-10 micrometers (μm)/5-10 micrometers (μm).
30. The method of claim 26, wherein a back side of the die is coupled to the back side redistribution portion through an adhesive.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
October 2, 2019
February 14, 2023
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