Patentable/Patents/US-11581755
US-11581755

Efficiency gains through magnetic field management

PublishedFebruary 14, 2023
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

A resonant induction wireless power transfer coil assembly designed for low loss includes a wireless power transfer coil, a non-saturated backing core layer adjacent the wireless power transfer coil, an eddy current shield, a gap layer between the backing core layer and the eddy current shield, and an enclosure that encloses the wireless power transfer coil, backing core layer, gap layer and eddy current shield. The gap layer has a thickness in a thickness range for a given thickness of the backing core layer where eddy current loss in the eddy current shield is substantially flat over the thickness range. A thickness of the backing core layer and a thickness of the gap layer are selected where a total power loss comprising power loss in the backing core layer plus eddy current loss over the gap layer is substantially minimized.

Patent Claims
18 claims

Legal claims defining the scope of protection, as filed with the USPTO.

2

2. The assembly of claim 1, wherein a thickness of the backing core layer and a thickness of the gap layer are selected where a total power loss comprising power loss in the backing core layer plus eddy current loss in the eddy current shield is substantially minimized.

3

3. The assembly of claim 1, wherein the gap layer comprises an air space.

4

4. The assembly of claim 1, wherein the gap layer comprises at least one of an air space, a non-magnetic filling agent, a non-magnetic structural support element, at least one non-magnetic conduit, or a non-magnetic coolant.

5

5. The assembly of claim 4, wherein the at least one non-magnetic conduit circulates a cooling/heating fluid.

6

6. The assembly of claim 5, wherein the fluid is a liquid.

7

7. The assembly of claim 4, wherein the at least one non-magnetic conduit comprises a non-conductive, non-magnetic material placed immediately against the backing core layer.

8

8. The assembly of claim 4, wherein the at least one non-magnetic conduit comprises a non-conductive, non-magnetic material placed immediately against the eddy current shield.

9

9. The assembly of claim 5, further comprising a thermal management device that circulates the cooling/heating fluid in the at least one non-magnetic conduit to thermally manage the backing core layer to substantially minimize power loss due to hysteresis heating.

10

10. The assembly of claim 5, further comprising a thermal management device that circulates the cooling/heating fluid in the at least one non-magnetic conduit to thermally manage the wireless power transfer coil assembly.

11

11. The assembly of claim 9, wherein the eddy current shield comprises one or more temperature sensors that provide temperature readings to the thermal management device, which controls circulation of the cooling/heating fluid to maintain the backing core layer at a predetermined temperature to minimize power loss.

12

12. The assembly of claim 11, wherein the thermal management device provides an inlet air temperature and temperature readings from the backing core layer to a predictive model to anticipate heating/cooling requirements, and when the cooling or heating requirements are forecast to exceed capabilities of passive cooling or passive heating, the circulation of the cooling/heating fluid is controlled by the thermal management device to adjust a temperature of the backing core layer.

13

13. The assembly of claim 12, further comprising a cooling/heating fluid reservoir with at least one valve that is controlled by the thermal management system to provide cooling/heating fluid to the gap layer via the at least one conduit.

14

14. The assembly of claim 1, wherein the backing core layer comprises at least one of ferrite, layered metallic sheets, powdered oxides, sintered powdered oxides, or amorphous metals.

16

16. The method of claim 15, further comprising selecting a thickness of the backing core layer versus a thickness of the gap layer where a total power loss comprising power loss in the backing core layer plus eddy current loss over the gap layer is substantially minimized.

17

17. The method of claim 15, further comprising circulating a cooling/heating fluid through at least one conduit in the gap layer that is placed immediately against the backing core layer.

18

18. The method of claim 17, further comprising a thermal management device thermally managing the backing core layer to minimize power loss by managing circulation of the cooling/heating fluid through the at least one conduit.

19

19. The method of claim 18, further comprising the thermal management device providing an inlet air temperature and temperature readings from the backing core layer to a predictive model to anticipate heating/cooling requirements, and when the cooling or heating requirements are forecast to exceed capabilities of passive cooling or passive heating, controlling circulation of the cooling/heating fluid to adjust a temperature of the backing core layer.

20

20. The method of claim 19, further comprising providing at least one cooling/heating fluid reservoir with at least one valve and the thermal management system controlling the at least one valve to provide cooling/heating fluid to the gap layer via the at least one conduit to provide heating or cooling to the backing core layer to substantially minimize power loss.

Classification Codes (CPC)

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Patent Metadata

Filing Date

July 28, 2020

Publication Date

February 14, 2023

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Cite as: Patentable. “Efficiency gains through magnetic field management” (US-11581755). https://patentable.app/patents/US-11581755

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