A component mounting system for mounting a component on a substrate, the mounting system comprising a component supplying unit configured to supply the component; a substrate holding unit configured to hold the substrate in an orientation such that a mounting face for mounting the component on the substrate is facing vertically downward; a head configured to hold the component from vertically below; and a head drive unit that, by causing vertically upward movement of the head holding the component, causes the head to approach the substrate holding unit to mount the component on the mounting face of the substrate.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The component mounting system according to claim 1, wherein the component supplying unit comprises (i) a sheet holding unit configured to hold a dicing substrate such that a sheet is positioned vertically upward of the dicing substrate, the dicing substrate being the substrate diced and attached to the sheet, and (ii) a picking mechanism configured to the component included in the dicing substrate by pick out vertically downward from vertically above the sheet.
4. The component mounting system according to claim 3, wherein the component conveying unit conveys the component by holding an upper surface side in a state in which a side of the substrate for mounting the component faces vertically upward.
16. The component mounting system according to claim 11, wherein an electrode surface and a dielectric surface are present in a bonding surface mounted on the mounting face of the component.
20. The component mounting system according to claim 17, wherein the component orientation adjusting unit comprises a plurality of piezo actuators configured to support the head, and adjusts at least one of (i) the distance between the mounting face and the component or (ii) the tilt of the component relative to the mounting face by causing expansion and contraction of the piezo actuators individually.
25. The component mounting system according to claim 24, wherein an electrode surface and a dielectric surface are present in a bonding surface mounted on the mounting face of the at least one of the components.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
January 31, 2018
February 21, 2023
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