Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further incudes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The system of claim 1 wherein the cooling member at least partially surrounds the pick head.
3. The system of claim 1 wherein the cooling member extends around an entire periphery of the pick head.
4. The system of claim 1 wherein the cooling member has an annular shape.
5. The system of claim 1 wherein the cooling member includes a port and defines a cavity, wherein the port is fluidly coupled to a cold fluid source, and wherein the cold fluid source is configured to at least partially fill the cavity with the cold fluid via the port.
6. The system of claim 1 wherein the support substrate includes a frame carrying a dicing tape.
7. The system of claim 1 wherein the semiconductor die has a lower surface and an upper surface opposite the lower surface, wherein the lower surface of the semiconductor die is releasably attached to an upper surface of the dicing tape at the die attach region, and wherein the cooling member directs the cold fluid toward the upper surface of the semiconductor die.
8. The system of claim 1 wherein the cold fluid is configured to loosen a bond between the semiconductor die and the support substrate.
9. The system of claim 1 wherein the cold fluid is a gas having a temperature of about or less than about −12 degrees Celsius.
10. The system of claim 1 wherein the cold fluid is a liquid that contacts the semiconductor die and/or the support substrate.
12. The method of claim 11 wherein the cooling structure is attached to the pick head.
13. The method of claim 11 wherein the cooling structure has an annular shape.
14. The method of claim 11 wherein the cooling structure extends around an entire periphery of the pick head.
15. The method of claim 11 wherein flowing the cold fluid includes flowing the cold fluid into a cavity of the cooling structure and from the cooling structure toward the support substrate and/or the semiconductor die.
16. The method of claim 11 wherein flowing the cold fluid includes flowing the cold fluid from cooling structure into contact with the semiconductor die.
17. The method of claim 11 wherein flowing the cold fluid includes flowing the cold fluid from the cooling structure into contact the support substrate.
19. The system of claim 18 wherein the cooling structure has an annular shape and surrounds the pick head.
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April 9, 2021
February 28, 2023
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