A light emitting diode (LED) package is provided. The LED package includes a package body having a concave portion; an LED chip disposed on the concave portion; a phosphor sheet disposed on the LED chip; a barrier wall disposed on the concave portion and spaced apart from the LED chip by a first distance, the barrier wall being disposed in parallel with at least one side surface of the LED chip, an upper surface of the barrier wall being higher than an upper surface of the LED chip with respect to the lower surface of the concave portion and disposed at a level that is 50 μm or less from an upper surface of the phosphor sheet; and an encapsulation portion disposed on the LED chip, a side surface of the phosphor sheet and a side surface of the barrier wall.
Legal claims defining the scope of protection, as filed with the USPTO.
3. The LED package of claim 1, wherein a concavo-convex portion is formed on at least one of a side wall and the upper surface of the barrier wall.
6. The LED package of claim 5, wherein the barrier wall extends around the plurality of LED chips to surround the plurality of LED chips.
8. The LED package of claim 1, wherein the first distance is between 50 μm and 200 μm.
9. The LED package of claim 1, wherein the upper surface of the barrier wall is at a level equal to or higher than an upper surface of the package body with respect to the lower surface of the concave portion.
10. The LED package of claim 1, wherein a length of the barrier wall is greater than a length of one side of the LED chip.
12. The LED package of claim 11, wherein the upper surface of the barrier wall is higher than an upper surface of the at least one LED chip with respect to the first region of the package body.
14. The LED package of claim 11, wherein a distance between a side surface of the phosphor sheet and the barrier wall is between 50 μm and 200 μm.
17. The LED package of claim 16, wherein the barrier wall is black and the encapsulation portion is white.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
May 19, 2020
February 28, 2023
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