Disclosed are chuck assemblies, semiconductor device fabricating apparatuses, and methods of fabricating semiconductor devices. The chuck assembly comprises a chuck base including lower and upper bases, a ceramic plate on the upper base, an edge ring that surrounds the ceramic plate, a ground ring that surrounds an outer sidewall of the edge ring on an edge portion of the lower base, a coupling ring between the ground ring and the upper base and between the edge ring and the edge portion of the lower base, an upper heat sink between the coupling ring and the edge ring, and a sidewall heat sink between the coupling ring and the ground ring and between the coupling ring and the upper base.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The chuck assembly of claim 1, wherein the sidewall heat sink has an inclination angle of about 22° to about 48.5° relative to a bottom surface of the upper heat sink.
3. The chuck assembly of claim 1, wherein the sidewall heat sink includes a radiation sheet.
5. The chuck assembly of claim 4, wherein each of the first and second sidewall heat sinks connects the upper heat sink to the edge portion of the lower base.
8. The chuck assembly of claim 7, wherein the lower base has a plurality of coolant holes connected to the first and second air gaps.
9. The chuck assembly of claim 4, wherein the second sidewall heat sink has a zigzag cross-section.
10. The chuck assembly of claim 1, wherein the upper base has a toothed wheel shape or a helical gear shape.
17. The method of claim 16, wherein the sidewall heat sink has an inclination angle of about 22° to about 48.5° relative to a bottom surface of the upper heat sink.
20. The method of claim 19, wherein cooling the edge, ground, and coupling rings includes providing a second coolant into the first and second air gaps.
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August 22, 2021
March 14, 2023
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