An antenna assembly is provided having passive cooling elements that enable compact design. In one example, an antenna assembly is provided that includes a heat sink assembly having an interior side and an exterior side, an antenna array, an antenna circuit board, and a radome. The antenna circuit board includes at least one integrated circuit (IC) die. The IC die has a conductive primary heat dissipation path to the interior side of the heat sink assembly. The radome is coupled to the heat sink assembly and encloses the antenna circuit board and the antenna array between the radome and the heat sink assembly. The heat sink assembly includes a metal base plate and at least a first heat pipe embedded with the metal base plate. The first heat pipe is disposed between the metal base plate and the IC die.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The antenna assembly of claim 1, wherein a first side of the base plate forms the exterior side of the heat sink assembly, and wherein the first side of the base plate further comprises a plurality of fins.
3. The antenna assembly of claim 2, wherein the plurality of fins are swaged in slots formed on the first side of the base plate.
4. The antenna assembly of claim 2, wherein the plurality of fins are arranged in multiple chevron-shaped rows.
5. The antenna assembly of claim 4, wherein sides of each chevron are separated to form an air channel extending though each of the chevron-shaped rows.
6. The antenna assembly of claim 2, wherein at least a first fin of the plurality of fins is corrugated.
13. The antenna assembly of claim 12, wherein the plurality of fins are swaged in slots formed on the first side of the base plate.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
December 23, 2020
March 14, 2023
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