Patentable/Patents/US-11616394
US-11616394

Electronic device

PublishedMarch 28, 2023
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

An electronic device includes a magnetic element, and a first circuit module. The magnetic element includes a magnetic core set and a winding assembled in the magnetic core set. The first circuit module is coupled to the first winding of the magnetic element. A vertical projection area of the first circuit module has an overlap portion with a vertical projection area of the winding of the magnetic core set on a first plane, and the first plane is a horizontal plane at which the winding is located.

Patent Claims
4 claims

Legal claims defining the scope of protection, as filed with the USPTO.

5

5. The electronic device of claim 4, wherein the capacitor module comprises a first capacitor and a second capacitor, wherein the first switch module, the fourth switch module, and the first capacitor are disposed at a first side of the first winding close to a magnetic core column, and the second switch module, the third switch module, and the second capacitor are disposed at a second side of the first winding.

6

6. The electronic device of claim 4, wherein the capacitor module comprises at least one capacitor, when the capacitor is disposed on the first surface, the capacitor is coupled to the second switch module and the third switch module through vias, and when the capacitor is disposed on the second surface, the capacitor is coupled to the first switch module and the fourth switch module through the vias.

8

8. The electronic device of claim 7, wherein the first switch module and the second switch module are disposed on a first surface of the first winding, and the third switch module and the fourth module are disposed on the first surface or a second surface of the first winding.

10

10. The electronic device of claim 9, wherein the capacitor module comprises at least one capacitor, when the capacitor is disposed on the first surface, the capacitor is coupled to the second switch module and the third switch module through vias, and when the capacitor is disposed on the second surface, the capacitor is coupled to the first switch module and the fourth switch module through the vias.

Classification Codes (CPC)

Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.

Patent Metadata

Filing Date

December 14, 2017

Publication Date

March 28, 2023

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