A method of manufacturing an electronic module includes providing a base substrate having a first surface, providing a first supporting element having a first portion with an inclined top surface, and affixing the first supporting element to the first surface such that the inclined top surface is inclined with respect to the base substrate. A first reflector is coupled to the inclined top surface such that a rear surface of the first reflector is in physical contact with the inclined top surface of the first portion of the first supporting element, and a spacer structure is configured to form an interface for mounting lateral walls to the base substrate. A cap is positioned over and supported by the lateral walls to thereby define a chamber. The emitter, as well as a detector, are coupled to the first surface of the base substrate.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The method of claim 1, wherein affixing the first supporting element comprises gluing the first supporting element to the first surface of the base substrate.
3. The method of claim 1, wherein the first supporting element is formed from the solid body of metal to have a second portion extending parallel to the base substrate when the first supporting element is affixed to the first surface of the base substrate.
4. The method of claim 3, wherein coupling the emitter comprises coupling the emitter to the second portion of the first supporting element.
5. The method of claim 4, wherein the first supporting element is formed from the solid body of metal such that the first and second portions of the first supporting element are integrally formed.
6. The method of claim 4, wherein the first supporting element is formed from the solid body of metal such that the first and second portions of the first supporting element are separate from one another and spaced apart from one another.
8. The method of claim 7, wherein the electronic circuitry for controlling the emitter is integrated into the second rigid portion of the rigid-flex circuit.
9. The method of claim 7, further comprising connecting a first end of a further flexible portion of the rigid-flex circuit to the second rigid portion and connecting a second end of the further flexible portion of the rigid-flex circuit to one or more pads for supplying driving signals and power supply to the first reflector.
10. The method of claim 1, wherein the spacer structure is also configured to completely surround a region of the base substrate in which the first supporting element, first reflector, emitter, and detector are located.
11. The method of claim 1, further comprising providing the spacer structure to be made from plastic material, metallic material, and/or semiconductor material; and further comprising providing the base substrate to be made from an organic material, plastic material, and/or semiconductor material.
12. The method of claim 1, further comprising providing the cap to include a second supporting element extending from an interior surface of the cap toward the emitter; and further comprising affixing a second reflector to the second supporting element.
14. The method of claim 13, wherein the spacer structure is also configured to completely surround a region of the base substrate in which the first reflector, emitter, and detector are located.
15. The method of claim 13, further comprising providing the spacer structure to be made from plastic material, metallic material, and/or semiconductor material; and further comprising providing the base substrate to be made from an organic material, plastic material, and/or semiconductor material.
16. The method of claim 13, further comprising providing the cap to include a second supporting element extending from an interior surface of the cap toward the emitter; and further comprising affixing a second reflector to the second supporting element.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
May 20, 2022
April 4, 2023
Browse 5M+ US patents with plain-English claim translations and AI-generated analysis.