Generally discussed herein are systems, devices, and methods that include an organic high density interconnect structure and techniques for making the same. According to an example a method can include forming one or more low density buildup layers on a core, conductive interconnect material of the one or more low density buildup layers electrically and mechanically connected to conductive interconnect material of the core, forming one or more high density buildup layers on an exposed low density buildup layer of the one or more low density buildup layers, conductive interconnect material of the high density buildup layers electrically and mechanically connected to the conductive interconnect material of the one or more low density buildup layers, and forming another low density buildup layer on and around an exposed high density buildup layer of the one or more high density buildup layers.
Legal claims defining the scope of protection, as filed with the USPTO.
3. The device of claim 1, wherein the laser resist material forms a part of the first routing layer.
4. The device of claim 3, wherein the organic buildup material includes an epoxy-based laminate composite.
5. The device of claim 1, wherein a portion of the first routing layer that is in direct electrical contact with the second routing includes a height that is less than a height of the first routing layer that is electrically isolated from the second routing layer.
6. The device of claim 5, further comprising an adhesion promoter on the first routing layer that includes the height that is less than the height of the first routing layer that is electrically isolated from the second routing layer.
7. The device of claim 6, wherein the organic buildup material includes a photo-imageable dielectric.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
November 8, 2021
April 18, 2023
Browse 5M+ US patents with plain-English claim translations and AI-generated analysis.