A microprocessor mounting apparatus comprising a microprocessor socket on a printed circuit board (PCB) and a bolster plate surrounding a perimeter of the microprocessor socket. The bolster plate has a first surface adjacent to the PCB, and a second surface opposite the first surface. A heat dissipation device is on the second surface of the bolster plate. The heat dissipation interface is thermally coupled to the microprocessor socket.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The microprocessor mounting apparatus of claim 1, wherein a thermal interface material is between the bolster plate and the microprocessor socket, and wherein the microprocessor socket is thermally coupled to the bolster plate by the thermal interface material.
3. The microprocessor mounting apparatus of claim 2, wherein the thermal interface material is a thermal grease, a thermal paste, a thermal gel or a thermal pad.
4. The microprocessor mounting apparatus of claim 1, wherein the heat dissipation device comprises a plurality of heat-dissipation fins over the second surface of the bolster plate.
5. The microprocessor mounting apparatus of claim 1, wherein the heat dissipation device is a vapor chamber joined to the second surface of the bolster plate, and to a heat sink.
6. The microprocessor mounting apparatus of claim 5, wherein the vapor chamber is joined to the bolster plate by a braze bond, a diffusion bond or an adhesive bond.
7. The microprocessor mounting apparatus of claim 5, wherein the vapor chamber comprises a plurality of heat-dissipation fins.
8. The microprocessor mounting apparatus of claim 1, wherein the heat dissipation device comprises a heat pipe joined to the second surface of the bolster plate.
9. The microprocessor mounting apparatus of claim 8, wherein the heat pipe is joined to the bolster plate by an adhesive bond, a braze bond or a solder bond.
10. The microprocessor mounting apparatus of claim 8, wherein the heat pipe comprises a plurality of heat-dissipation fins.
11. The microprocessor mounting apparatus of claim 1, wherein the heat dissipation device comprises a cold plate interfaced to the second surface of the bolster plate.
12. The microprocessor mounting apparatus of claim 11, wherein the heat dissipation device further comprises a conduit coupled to the cold plate, and wherein the conduit is to conduct a fluid to and from the cold plate.
13. The microprocessor mounting apparatus of claim 12, wherein the fluid comprises at least one of water, methanol, ethanol, isopropanol or n-propanol.
14. The microprocessor mounting apparatus of claim 11, wherein the cold plate is joined to the bolster plate by a braze bond, a diffusion bond or an adhesive bond.
16. The assembly of claim 15, wherein a heat sink or heat pipe is thermally coupled to the heat dissipation device.
17. The assembly of claim 15, wherein the heat dissipation device comprises a plurality of heat-dissipation fins.
18. The assembly of claim 15, wherein the heat dissipation device is a first heat dissipation device, and wherein a second heat dissipation device is on a surface of the back plate.
20. The system of claim 19, further comprising a vapor chamber, a plurality of heat dissipation fins, or a heat pipe coupled to the bolster plate.
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June 27, 2019
May 9, 2023
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