A semiconductor structure is disclosed. The semiconductor structure includes a substrate an elastomer coupled to the substrate and a plurality of bondfingers on the elastomer. The substrate, the elastomer and the bondfingers are configured to cooperatively expand and retract.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The semiconductor structure of claim 1, wherein the bondfingers include a serpentine pattern of interconnected parts.
3. The semiconductor structure of claim 1, wherein the bondfingers are configured to be expanded before wirebonding.
4. The semiconductor structure of claim 1, wherein the bondfingers are configured to be retracted after wirebonding.
5. The semiconductor structure of claim 1, wherein the substrate is configured to be expanded in response to an application of heat to the semiconductor structure.
6. The semiconductor structure of claim 1, wherein the substrate is configured to have an expansion of the substrate.
8. The semiconductor package of claim 7, wherein the bondfingers include a serpentine pattern of interconnected parts.
9. The semiconductor package of claim 7, wherein the bondfingers are configured to be expanded before wirebonding.
10. The semiconductor package of claim 7, wherein the bondfingers are configured to be retracted after wirebonding.
11. The semiconductor package of claim 7, wherein the substrate is configured to be expanded in response to an application of heat to the semiconductor package.
12. The semiconductor package of claim 7, wherein the substrate is configured to have an expansion of the substrate.
14. The method of claim 13, wherein the bondfingers include a serpentine pattern of interconnected parts.
15. The method of claim 13, wherein the bondfingers are configured to be expanded before wirebonding.
16. The method of claim 13, wherein the bondfingers are configured to be retracted after wirebonding.
17. The method of claim 13, wherein the substrate is configured to be expanded in response to an application of heat to the substrate.
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December 13, 2018
May 16, 2023
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