A substrate assembly includes a printed circuit (PC) substrate, first and second microchips, components or substrates mounted on a surface of the PC substrate, and a projection extending in spaced relation to the surface of the PC substrate. In one example, the projection extends between (i) a downward facing surface and/or an edge of a side facing surface proximate the downward facing surface of the first microchip, component or substrate and (ii) an upward facing surface and/or an edge of a side facing surface proximate the upward facing surface of the first microchip, component or substrate. The first and second microchips, components or substrates may be mounted on different levels of the PC substrate surface. In another example, the projection extends between a upward and/or side facing surface of a first microchip, component or substrate and a slot or cavity in a second microchip, component or substrate.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The substrate assembly of claim 1, wherein the projection extends laterally or substantially laterally between the first microchip, component or substrate and the second microchip, component or substrate.
3. The substrate assembly of claim 1, wherein the projection is formed partially or entirely of the conductive material.
7. The substrate assembly of claim 6, wherein the first and second parts are in electrical contact either directly or via an interposer.
8. The substrate assembly of claim 1, further including a heat sink mounted on a side of the PC substrate opposite the surface on which the first and second microchips, components or substrates are mounted.
9. The substrate assembly of claim 8, wherein the heat sink includes a part that extends through the PC substrate.
10. The substrate assembly of claim 9, wherein at least one of the first and second microchips, components or substrates are at least partially mounted on a surface of the part of the heat sink that extends through the PC substrate.
12. The substrate assembly of claim 11, wherein the projection extends laterally or substantially laterally between the first microchip, component or substrate and the second microchip, component or substrate.
13. The substrate assembly of claim 11, wherein the projection is formed partially or entirely of the conductive material.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
January 28, 2021
May 23, 2023
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