Patentable/Patents/US-11682596
US-11682596

Power semiconductor module

PublishedJune 20, 2023
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

A power semiconductor module includes an insulating circuit substrate; a printed circuit board disposed over the insulating circuit substrate; and a plurality of terminals each having a rod-shaped portion and including a first protrusion and a second protrusion each protruding laterally form a side face of the rod-shaped portion; wherein at least one of the plurality of terminals is inserted to one of the through-holes of the printed circuit board and is locked to the one of the through-holes via the first protrusion, and wherein at least another one of the plurality of terminals is inserted to another one of the through-holes of the printed circuit board and is locked to said another one of the through-holes via the second protrusion, and an end of the at least another one of the plurality of terminals is electrically connected to a conductive plate on the insulating circuit substrate.

Patent Claims
5 claims

Legal claims defining the scope of protection, as filed with the USPTO.

2

2. The power semiconductor module according to claim 1, wherein in each of the plurality of terminals, the first and second protrusions protrude laterally from the side face in mutually different directions.

3

3. The power semiconductor module according to claim 1, wherein an outermost dimension of the second protrusion is greater than an outermost dimension of the first protrusion.

4

4. The power semiconductor module according to claim 1, wherein in each of the plurality of terminals, at least one of the first and second protrusions has more than one protruding parts in a cross section taken along a plane perpendicular to an elongated direction of the rod-shaped part of the terminal.

5

5. The power semiconductor module according to claim 4, wherein in each of the plurality of terminals, said at least one of the first and second protrusions has a crisscross shape in the cross-sectional view taken along the plane perpendicular to the elongated direction of the rod-shaped part of the terminal.

6

6. The power semiconductor module according to claim 1, wherein each of said one of the plurality of terminals and said another one of the plurality of terminals has a recess to engage with the sealing part.

Classification Codes (CPC)

Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.

Patent Metadata

Filing Date

October 6, 2020

Publication Date

June 20, 2023

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Cite as: Patentable. “Power semiconductor module” (US-11682596). https://patentable.app/patents/US-11682596

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