Pressure balancing clamp for press-pack insulated gate bipolar transistor module

2. The pressure balancing clamp for a press-pack IGBT module according to claim 1, wherein the upper top plate has a layout axis, four guide rods are arranged and are arranged sequentially along a circumferential direction of the layout axis of the upper top plate, and the hydraulic devices are arranged on a connecting line between the layout axis of the upper top plate and axes of the guide rods.

3. The pressure balancing clamp for a press-pack IGBT module according to claim 1, wherein the displacement compensation device comprises a disc spring; a lower surface of the pressure equalizing plate at lower end and the lower top plate are connected by the disc spring, and the disc spring longitudinally corresponds to the heat dissipation and confluence devices.

4. The pressure balancing clamp for a press-pack IGBT module according to claim 3, wherein the displacement compensation device further comprises a disc spring guide and a disc spring washer, wherein the disc spring washer is arranged at a joint of the disc spring and the lower top plate, and the disc spring guide is arranged at a joint of the pressure equalizing plate at lower end and the disc spring.

5. The pressure balancing clamp for a press-pack IGBT module according to claim 4, wherein the disc spring guide penetrates through the disc spring and the disc spring washer respectively, and is fixed in a central hole in a center of the lower top plate, and a lower surface of the disc spring guide is higher than a bottom surface of the lower top plate.

6. The pressure balancing clamp for a press-pack IGBT module according to claim 1, wherein upper ends of side walls of the guide rods are screwed with nuts, and lower surfaces of the nuts and an upper surface of the upper top plate clamp backing rings.