Surface-emitting light source and method of manufacturing the same

2. The surface-emitting light source according to claim 1, wherein each of the pad openings in the covering layer has a size that allows the plurality of vias formed in each of the wiring pads to be exposed in a single opening of the covering layer.

3. The surface-emitting light source according to claim 1, wherein each of the pad openings in the covering layer are formed for a respective one of the vias.

5. The surface-emitting light source according to claim 1, wherein each of the pad openings has a bilaterally symmetric shape with respect to the center of a corresponding one of the vias.

7. The surface-emitting light source according to claim 1, wherein at least one of the pad openings comprises the first rectangular opening and the second rectangular opening for each of the wiring pads, the first rectangular opening and the second rectangular opening being formed adjacent to each other for respective single vias of the vias.

10. The surface-emitting light source according to claim 1, wherein a protective member is disposed to cover the electrically-conductive members.

11. The surface-emitting light source according to claim 1, wherein the wiring layer is disposed on the front surface of the base member.

12. The surface-emitting light source according to claim 1, wherein the adhesive layer has an elasticity lower than an elasticity of the base member.

15. The method of manufacturing the surface-emitting light source according to claim 14, wherein the step of pressing is performed using a metal mold through a sheet having a size that is the same as a size of the openings in a plan view and having a thickness equal to a depth of the openings.

16. The method of manufacturing the surface-emitting light source according to claim 14, wherein the step of pressing is performed using a metal mold having protrusions forming a recess-and-protrusion pattern inverted with respect to a recess-and-protrusion pattern including recesses each formed between a surface of a corresponding one of the wiring pads and a surface of the covering layer.

17. The method of manufacturing the surface-emitting light source according to claim 14, the method further comprising, after pressing, disposing a protective member to cover the electrically-conductive members from one surface side of the wiring substrate.

18. The method of manufacturing the surface-emitting light source according to claim 14, wherein in the step of supplying, the electrically-conductive material is screen-printed.

19. The method of manufacturing the surface-emitting light source according to claim 14, wherein an additional wiring layer is disposed on the front surface of the base member.