Integrated circuit assemblies having metal foam structures

2. The integrated circuit assembly of claim 1, further comprising a stiffener attached to the electronic substrate, wherein the metal foam is disposed between the stiffener, the at least one integrated circuit device, the electronic substrate, and the heat dissipation device.

3. The integrated circuit assembly of claim 1, wherein the metal foam comprises a solid metal matrix having a plurality of cells.

4. The integrated circuit assembly of claim 1, wherein the metal foam comprises a non-metallic matrix having a plurality of cells and a metal coated on the non-metallic matrix.

5. The integrated circuit assembly of claim 1, wherein the at least one integrated circuit device comprises a first surface, an opposing second surface, and at least one side extending between the first surface and the second surface of the at least one integrated circuit device, and wherein the metal foam contacts the at least one side of the at least one integrated circuit.

6. The integrated circuit assembly of claim 1, wherein the heat dissipation device includes a main body having a first surface and a boundary wall extending from the first surface of the main body of the heat dissipation device, and wherein the boundary wall is attached to the electronic substrate.

7. The integrated circuit assembly of claim 1, wherein the metal foam is open cell.

8. The integrated circuit assembly of claim 1, wherein the metal foam is closed cell.

10. The electronic system of claim 9, further comprising a stiffener attached to the electronic substrate, wherein the metal foam is disposed between the stiffener, the at least one integrated circuit device, the electronic substrate, and the heat dissipation device.

11. The electronic system of claim 9, wherein the metal foam comprises a solid metal matrix having a plurality of cells.

12. The electronic system of claim 9, wherein the metal foam comprises a non-metallic matrix having a plurality of cells and a metal coated on the non-metallic matrix.

13. The electronic system of claim 9, wherein the at least one integrated circuit device comprises a first surface, an opposing second surface, and at least one side extending between the first surface and the second surface of the at least one integrated circuit device, and wherein the metal foam contacts the at least one side of the at least one integrated circuit.

14. The electronic system of claim 9, wherein the heat dissipation device includes a main body having a first surface and a boundary wall extending from the first surface of the main body of the heat dissipation device, and wherein the boundary wall is attached to the electronic substrate.

16. The method of claim 15, further comprising attaching a stiffener to the electronic substrate, and wherein forming the metal foam further comprises disposing the metal foam between the stiffener, the at least one integrated circuit device, the electronic substrate, and the heat dissipation device.

17. The method of claim 15, wherein forming the metal foam comprises forming a solid metal matrix having a plurality of cells.

18. The method of claim 15, wherein forming the metal foam comprises forming a non-metallic matrix having a plurality of cells and a metal coated on the non-metallic matrix.

19. The method of claim 15, wherein forming the at least one integrated circuit device comprises forming the at least one integrated circuit device having a first surface, an opposing second surface, and at least one side extending between the first surface and the second surface of the at least one integrated circuit device, and further comprising contacting the metal foam with the at least one side of the at least one integrated circuit.

20. The method of claim 15, wherein forming the heat dissipation device includes forming a main body having a first surface and forming a boundary wall extending from the first surface of the main body of the heat dissipation device, and attaching the boundary wall to the electronic substrate.