Patentable/Patents/US-11728162
US-11728162

Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

PublishedAugust 15, 2023
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

Patent Claims
10 claims

Legal claims defining the scope of protection, as filed with the USPTO.

11

11. The method according to claim 1, wherein (a) and (b) are performed in the same process chamber.

12

12. The method according to claim 1, wherein (a) and (b) are performed in different process chambers.

13

13. A non-transitory computer-readable recording medium storing a program that causes, by a computer, a substrate processing apparatus to perform the method of claim 1.

14

14. A method of manufacturing a semiconductor device, comprising the method of claim 1.

16

16. A non-transitory computer-readable recording medium storing a program that causes, by a computer, a substrate processing apparatus to perform the method of claim 15.

17

17. A method of manufacturing a semiconductor device, comprising the method of claim 15.

19

19. The method according to claim 18, wherein the first precursor gas is more difficult to decompose than the second precursor gas under a same condition.

20

20. The method according to claim 18, wherein the first precursor gas contains one Si in one molecule, and the second precursor gas contains two or more Si in one molecule.

21

21. A non-transitory computer-readable recording medium storing a program that causes, by a computer, a substrate processing apparatus to perform the method of claim 18.

22

22. A method of manufacturing a semiconductor device, comprising the method of claim 18.

Patent Metadata

Filing Date

Unknown

Publication Date

August 15, 2023

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Cite as: Patentable. “Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium” (US-11728162). https://patentable.app/patents/US-11728162

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