Chip package

2. The chip package of claim 1, wherein the bottom portion and the top portion of the molding material respectively have a first through hole and a second through hole, and the first conductive pad and the second conductive pad are respectively located below the first through hole and the second through hole.

3. The chip package of claim 1, wherein the inclined portion and the bottom portion of the molding material form an obtuse angle.

4. The chip package of claim 1, wherein a top surface of the bottom portion is lower than a top surface of the top portion.

5. The chip package of claim 1, further comprising an adhesive layer disposed between the first die and the second die.

6. The chip package of claim 1, wherein the passivation layer and the molding material comprise different materials.

8. The chip package of claim 7, wherein the bottom portion and the top portion of the molding material respectively have a first through hole and a second through hole, and the first conductive pad and the second conductive pad are respectively located below the first through hole and the second through hole.

9. The chip package of claim 7, wherein the inclined portion and the bottom portion of the molding material form an obtuse angle.

10. The chip package of claim 7, wherein the top surface of the bottom portion is lower than the top surface of the top portion.

11. The chip package of claim 7, further comprising an adhesive layer disposed between the first die and the second die.

12. The chip package of claim 7, wherein the passivation layer and the molding material comprise different materials.