Double-sided cooling type power module and manufacturing method therefor

3. The power module according to claim 2, wherein the gate electrode is connected to the signal pin or terminal without a wire.

4. The power module according to claim 1, wherein the first metal plate is electrically connected to the collector electrode of the first power element and the emitter electrode of the second power element.

7. The power module according to claim 6, wherein the one of the plurality of first metal plates comprises a plurality of metal plates divided by the at least one first slit.

8. The power module according to claim 1, wherein the first and second metal plates are disposed at opposing surfaces of the first substrate and the second substrate.

9. The power module according to claim 1, further comprising a signal pin and a terminal that extend outside the first and second substrates, at least one of the signal pin or the terminal being bent with respect to the first substrate or the second substrate.

10. The power module according to claim 1, further comprising an insulation portion that is disposed between the first substrate and the second substrate and covers side surfaces of the first metal plate, the second metal plate, and the plurality of power elements.

14. The power module according to claim 1, wherein the thicknesses of the first and second spacers are greater than the thicknesses of the first and second power elements, respectively.