Integrated circuit package structure and method of manufacturing the same

2. The IC package structure according to claim 1, wherein the molding compound structure includes a first molding compound layer provided on the plurality of outer side surfaces of the chip and on the plurality of outer side surfaces on the RDL structure; and the EMI shielding structure including a first EMI shielding layer provided on a plurality of outer side surfaces of the first molding compound layer.

6. The IC package structure according to claim 5, wherein the molding compound structure at least directly covers at least one outer surface of the RDL structure.

7. The IC package structure according to claim 1, wherein the outer side surfaces of the chip and the outer side surfaces of the RDL structure are flush with an inner surface of the molding compound structure.