Heatsink installation

2. The heatsink interface component of claim 1, when the heatsink interface component is placed in physical communication with the printed circuit board assembly, the first portion of the first side extends between an upstream processor and a downstream processor on the printed circuit board.

4. The heatsink interface component of claim 3, when the heatsink interface component is placed in physical communication with the printed circuit board assembly, the second portion of the second side extends below a top surface of the upstream processor.

5. The heatsink interface component of claim 1, when the upstream heatsink is placed in physical communication with the heatsink interface component, each of the posts is placed within a respective notch of a plurality of notches in a heatsink base of the upstream heatsink.

6. The heatsink interface component of claim 1, when the heatsink interface component is placed in physical communication with the printed circuit board assembly, each of the recesses receives a respective post of a second plurality of posts on the printed circuit board assembly.

7. The heatsink interface component of claim 1, when a downstream heatsink is placed in physical communication with the heatsink interface component, each of the posts interferes with a bottom surface of a heatsink base of the downstream heatsink, wherein the interference between the posts and the bottom surface creates a gap between the downstream heatsink and a top surface of an upstream processor of the printed circuit board.

9. The information handling system of claim 8, when the heatsink interface component is placed in physical communication with the printed circuit board assembly, the first portion of the first side extends between the upstream processor and a downstream processor on the printed circuit board assembly.

11. The information handling system of claim 10, when the heatsink interface component is placed in physical communication with the printed circuit board assembly, the second portion of the second side extends below a top surface of the upstream processor.

12. The information handling system of claim 8, when an upstream heatsink is placed in physical communication with the heatsink interface component, each of the posts are placed within a respective notch of a plurality of notches in a heatsink base of the upstream heatsink.

13. The information handling system of claim 8, when the heatsink interface component is placed in physical communication with the printed circuit board assembly, each of the recesses receives a respective post of a second plurality of posts on the printed circuit board assembly.

14. The information handling system of claim 8, when a downstream heatsink is placed in physical communication with the heatsink interface component, each of the posts interferes with a bottom surface of a heatsink base of the downstream heatsink, wherein the interference between the posts and the bottom surface creates a gap between the downstream heatsink and a top surface of the upstream processor of the printed circuit board.

16. The information handling system of claim 15, when the upstream heatsink is placed in physical communication with the heatsink interface component, each of the posts are placed within a respective notch of a plurality of notches in a heatsink base of the upstream heatsink.

17. The information handling system of claim 15, when the heatsink interface component is placed in physical communication with the printed circuit board assembly, each of the recesses receives a respective post of a second plurality of posts on the printed circuit board assembly.