Patentable/Patents/US-11848301
US-11848301

Method of manufacturing a semiconductor package

PublishedDecember 19, 2023
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

Patent Claims
16 claims

Legal claims defining the scope of protection, as filed with the USPTO.

2

2. The method of claim 1, wherein the at least one thermal compensating block extends to surround a corner portion of the first die.

3

3. The method of claim 1, wherein the at least one thermal compensating block extends to completely surround the at least one die.

4

4. The method of claim 1, wherein the at least one thermal compensating block includes a thermal insulating material.

5

5. The method of claim 1, further comprising forming bumps on bonding pads of the first die prior to holding the first die.

6

6. The method of claim 5, wherein heating and thermally pressurizing the first die on the second die includes reflowing the bumps to form conductive bumps between the first die and the second die.

7

7. The method of claim 1, further comprising coating an adhesive film on the second die prior to placing the first die on the second die.

8

8. The method of claim 1, further comprising bonding a third die on the first die, using the bonding head.

9

9. The method of claim 1, wherein the at least one compensating block includes a heating source therein.

10

10. The method of claim 1, wherein the thermal at least one compensating block includes a plurality of stacked blocks.

13

13. The method of claim 12, wherein heating and thermally pressurizing the first die on the second die includes reflowing the bumps to form conductive bumps between the first die and the second die.

14

14. The method of claim 11, further comprising bonding a third die on the first die, using the bonding head.

15

15. The method of claim 11, wherein the at least one thermal compensating block includes a thermal insulating material.

17

17. The method of claim 11, wherein the at least one thermal compensating block extends to surround a corner portion of the at least one die.

18

18. The method of claim 11, wherein the at least one thermal compensating block extends to completely surround the at least one die.

19

19. The method of claim 11, wherein a spacing distance between the heat reflective surface and a side surface of the at least one die is 10 mm or less.

20

20. The method of claim 11, wherein the at least one thermal compensating block includes a plurality of stacked blocks.

Patent Metadata

Filing Date

Unknown

Publication Date

December 19, 2023

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Cite as: Patentable. “Method of manufacturing a semiconductor package” (US-11848301). https://patentable.app/patents/US-11848301

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