Patentable/Patents/US-11854892
US-11854892

Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by them

PublishedDecember 26, 2023
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

Patent Claims
13 claims

Legal claims defining the scope of protection, as filed with the USPTO.

2

2. The laser apparatus of claim 1, wherein each of the first axicon lens and the second axicon lens has triangle shape.

3

3. The laser apparatus of claim 1, wherein the first inclined surface and the second inclined surface face each other.

5

5. The laser apparatus of claim 4, wherein the first flat surface is spaced apart from the second flat surface by a distance of 15 mm.

6

6. The laser apparatus of claim 4, wherein each of the first flat surface and the second flat surface has a diameter of 14 mm.

7

7. The laser apparatus of claim 1, wherein the laser beam has a pulse frequency of 100 kHz and a wavelength of 1100 nm.

8

8. The laser apparatus of claim 1, wherein the laser beam has a power ranging from 0.5 W to 2.5 W.

9

9. The laser apparatus of claim 1, wherein the light source includes a laser diode.

11

11. The laser apparatus of claim 10, wherein each of the first flat surface and the second flat surface has a diameter of 14 mm.

12

12. The laser apparatus of claim 10, wherein the light source is configured to generate the laser beam to have a pulse frequency of 100 kHz and a wavelength of 1100 nm.

13

13. The laser apparatus of claim 10, wherein the laser beam has a pulse frequency of 100 kHz and a wavelength of 1100 nm.

15

15. The laser apparatus of claim 14, wherein the first flat surface is spaced apart from the second flat surface by a distance of 15 mm.

16

16. The laser apparatus of claim 14, wherein the light source is configured to generate the laser beam to have a pulse frequency of 100 kHz and a wavelength of 1100 nm.

17

17. The laser apparatus of claim 14, wherein the laser beam has a pulse frequency of 100 kHz and a wavelength of 1100 nm.

Patent Metadata

Filing Date

Unknown

Publication Date

December 26, 2023

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Cite as: Patentable. “Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by them” (US-11854892). https://patentable.app/patents/US-11854892

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