A second-level thermal interface material (TIM2) that is to couple to a system-level thermal solution is applied to an integrated circuit (IC) assembly comprising an IC die and an assembly substrate prior to the assembly substrate being joined to a host component at the system-level. Challenges associated with TIM2 application may therefore be addressed at a first level of IC die integration, simplifying subsequent assembly and better controlling thermal coupling to a subsequently applied thermal solution. Where a first-level IC assembly includes a stiffener, the TIM may be affixed to the stiffener through an adhesive bond or a fusion bond. After the IC assembly including the TIM is soldered to the host board, a thermal solution may be placed in contact with the TIM. With early application of a solder TIM, a solder TIM may be reflowed upon the IC die multiple times.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The IC assembly of claim 1, wherein the TIM is physically coupled to the stiffener through an adhesive material that is between the TIM and the stiffener.
5. The IC assembly of claim 4, wherein the TIM is physically coupled to the stiffener through a fusion bond of one or more of the first metal particles with one or more of the second metal particles.
9. The IC assembly of claim 8, further comprising a host component, wherein the assembly substrate is electrically coupled to the host component through one or more second solder interconnects, and wherein the TIM has a lower melting temperature than the second solder interconnects.
11. The IC assembly of claim 10, wherein the first and second intermetallic compounds comprise Ga.
12. The IC assembly of claim 11, wherein the base plate and the second intermetallic compound comprise the first metal.
13. The IC assembly of claim 7, wherein the region of the assembly substrate is a center region, the assembly further comprises a stiffener over, and physically coupled to, a peripheral region of the assembly substrate, and the TIM is absent from a surface of the stiffener opposite the assembly substrate.
15. The method of claim 14, further comprising dispensing the adhesive over the surface of the stiffener without dispensing any of the adhesive onto the surface of the IC die.
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January 17, 2020
January 23, 2024
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