The disclosed wafer processing apparatus includes a vacuum chuck unit configured to adsorb and support a wafer assembly including a wafer; a rotary chuck unit configured to rotate the vacuum chuck unit; a rotating shaft connected to the rotary chuck unit to rotate the rotary chuck unit; a ring cover unit configured to press the wafer assembly such that a processing solution sprayed onto the wafer is not diffused into the vacuum chuck unit; a sealing ring installed in the vacuum chuck unit and configured to support the wafer assembly; and a medium supply unit configured to supply an inspection medium to the vacuum chuck unit such that the inspection medium for identifying damage to the sealing ring flows into the sealing ring.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The wafer processing apparatus of claim 1, wherein a vertical medium flow path for supplying a fluid medium to the sealing ring is formed in the rotating shaft.
3. The wafer processing apparatus of claim 2, wherein the wafer processing apparatus further includes a rotary joint including a rotating core connected to the rotating shaft to rotate together with the rotating shaft and a fixed core configured to surround the rotating core and rotatably support the rotating core.
6. The wafer processing apparatus of claim 5, wherein the rotary joint further includes a vacuum flow path packing with an annular shape which is installed on the inner circumferential surface of the fixed core such that vacuum pressure of the one of more vacuum connection flow paths is prevented from being weakened due to a fluid flowing into the one or more vacuum connection flow paths between the first horizontal vacuum flow path and the second vacuum horizontal flow path.
8. The wafer processing apparatus of claim 5, wherein the rotary joint further includes a press flow path packing with an annular shape which is installed on an inner circumferential surface of the fixed core such that pneumatic pressure of the one or more press connection flow paths is prevented from being weakened due to a fluid leaking outward from the one or more press connection flow paths between the first horizontal press flow path and the second horizontal press flow path.
10. The wafer processing apparatus of claim 3, wherein the rotating core includes a ceramic coating layer stacked on an outer circumferential surface thereof to reduce friction when the rotating core rotates with respect to the fixed core.
11. The wafer processing apparatus of claim 3, wherein the rotary joint further includes a cooling case configured to surround an outer circumferential surface of the fixed core such that a cooling flow path, in which a refrigerant flows, is formed between the cooling case and the fixed core.
13. The wafer processing apparatus of claim 12, wherein the medium supply unit further includes a flow rate detection unit configured to measure a flow rate of the inspection medium supplied from the medium supply pipe to the vacuum chuck unit.
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March 25, 2022
February 13, 2024
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