A semiconductor device includes a lead frame, a transistor, and an encapsulation resin. The lead frame includes a drain frame, a source frame, and a gate frame. The drain frame includes drain frame fingers. The source frame includes source frame fingers. The drain frame fingers and the source frame fingers are alternately arranged in a first direction and include overlapping portions as viewed from a first direction. In a region where each drain frame finger overlaps the source frame fingers as viewed in the first direction, at least either one of the drain frame fingers and the source frame fingers are not exposed from the back surface of the encapsulation resin.
Legal claims defining the scope of protection, as filed with the USPTO.
3. The semiconductor device according to claim 1, further comprising wires arranged in the transistor, the wires extending along the first direction to intersect with the first electrodes and the second electrodes and electrically connected to the first electrodes or the second electrodes at intersecting portions.
6. The semiconductor device according to claim 1, wherein the plurality of first electrode pads and the plurality of second electrode pads are each divided into a plurality of parts in the second direction.
8. The semiconductor device according to claim 7, wherein the plurality of first electrode pads arranged in the second direction and the plurality of second electrode pads arranged in the second direction are alternately arranged in the first direction.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
April 20, 2022
February 13, 2024
Browse 5M+ US patents with plain-English claim translations and AI-generated analysis.