A wafer processing method of the present invention includes mounting a wafer part on a chuck table, loading the wafer part on the chuck table, spraying, by a spray arm module, a first processing solution onto the wafer part to process the wafer part, spraying, by the spray arm module, a second processing solution onto the wafer part to process the wafer part, drying the wafer part on the chuck table, and unloading the wafer part from the chuck table.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The wafer processing method of claim 1, wherein the mounting of the wafer part on the chuck table further includes: lowering the transfer device to place the wafer part on the chuck table.
4. The wafer processing method of claim 3, wherein the first processing solution is deionized (DI) water.
5. The wafer processing method of claim 1, wherein the spraying of the second processing solution onto the wafer part to process the wafer part includes swinging the spray arm module within a certain angle range to spray the second processing solution onto the wafer part.
6. The wafer processing method of claim 5, wherein the second processing solution is a mixture of deionized (DI) water and nitrogen (N2).
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July 15, 2022
February 27, 2024
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