Solid-state radiation transducer (SSRT) devices and methods of manufacturing and using SSRT devices are disclosed herein. One embodiment of the SSRT device includes a radiation transducer (e.g., a light-emitting diode) and a transmissive support assembly including a transmissive support member, such as a transmissive support member including a converter material. A lead can be positioned at a back side of the transmissive support member. The radiation transducer can be flip-chip mounted to the transmissive support assembly. For example, a solder connection can be present between a contact of the radiation transducer and the lead of the transmissive support assembly.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The SSRT device of claim 1, wherein the transmissive support member has a textured side.
3. The SSRT device of claim 1, wherein at least a portion of a side of the transmissive support member is convex.
4. The SSRT device of claim 1, wherein the radiation transducer is flip-chip mounted on the transmissive support assembly.
5. The SSRT device of claim 1, wherein the underfill material is substantially optically-transparent.
8. The SSRT device of claim 7, wherein the second transmissive support member has a refractive index from about 1.6 to about 1.9.
10. The SSRT device of claim 1, wherein the radiation transducer is a photovoltaic cell.
12. The method of claim 11, wherein the underfill material is substantially optically-transparent.
14. The method of claim 11, further comprising forming the transmissive support member, wherein forming the transmissive support member includes spin coating a precursor material onto a substrate.
15. The method of claim 11, further comprising forming the transmissive support member, wherein forming the transmissive support member includes texturing a side of the transmissive support member.
16. The method of claim 11, further comprising forming the transmissive support member, wherein forming the transmissive support member includes molding a precursor material.
17. The method of claim 16, wherein molding the precursor material includes introducing the precursor material into a mold having a textured surface.
18. The method of claim 16, wherein molding the precursor material includes introducing the precursor material into a mold having a concave surface.
19. The SSRT device of claim 1, wherein the first lead is soldered to the p-type contact with an optically-transparent solder, and wherein the second lead is soldered to the n-type contact with the optically-transparent solder.
20. The method of claim 16, wherein forming the first solder connection comprises forming a first optically-transparent solder connection and wherein forming the second solder connection comprises forming a second optically-transparent solder connection.
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November 26, 2019
March 12, 2024
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