Disclosed herein are integrated circuit (IC) package lids with polymer features, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A foot or rib of the lid may include a polymer material.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The IC package of claim 1, wherein the planar metal portion is a rectangular solid.
3. The IC package of claim 1, wherein the height of the polymer portion is between 200 microns and 1.5 millimeters.
4. The IC package of claim 1, wherein the IC package is a ball grid array package.
6. The IC package of claim 5, wherein the package support includes a package substrate.
7. The IC package of claim 5, wherein the package support includes an interposer.
8. The IC package of claim 5, wherein the height of the polymer portion is greater than a thickness of the die.
9. The IC package of claim 5, wherein the height of the polymer portion is between 200 microns and 1.5 millimeters.
10. The IC package of claim 5, wherein the polymer portion may be stretched up to 300 microns without mechanical failure of the polymer portion.
11. The IC package of claim 1, wherein one end of the polymer portion is in contact with the metal portion that extends from the planar metal portion towards the package support and another end of the polymer portion is in contact with the package support.
12. The IC package of claim 2, wherein the metal portion that extends from the planar metal portion towards the package support is materially continuous with the rectangular solid of the planar metal portion.
13. The IC package of claim 1, wherein no portion of sidewalls of the polymer portion is in contact with the metal portion of the foot.
14. The IC package of claim 13, wherein no portion of the metal portion of the foot is in contact with the sidewalls of the polymer portion.
15. The IC package of claim 1, wherein no portion of the metal portion of the foot is in contact with sidewalls of the polymer portion.
16. The IC package of claim 1, wherein the package support is a package substrate.
17. The IC package of claim 1, wherein the package support is an interposer.
18. The IC package of claim 5, wherein all of the metal portion is further away from the package support than the die.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
June 25, 2019
March 19, 2024
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