Disclosed herein are integrated circuit (IC) package lids with polymer features, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A foot or rib of the lid may include a polymer material.
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
2. The IC package of claim 1, wherein the planar metal portion is a rectangular solid.
An integrated circuit (IC) package features a lid, a package support (e.g., a package substrate or an interposer), and a die situated between them. The lid includes a planar metal portion, which is specifically shaped as a rectangular solid. From this rectangular solid, a separate metal portion extends downwards towards the package support. A polymer portion is arranged such that one end contacts this extending metal portion, and its other end contacts the package support.
3. The IC package of claim 1, wherein the height of the polymer portion is between 200 microns and 1.5 millimeters.
An integrated circuit (IC) package features a lid, a package support (e.g., a package substrate or an interposer), and a die situated between them. The lid includes a planar metal portion, from which a separate metal portion extends downwards towards the package support. A polymer portion is arranged such that one end contacts this extending metal portion, and its other end contacts the package support. The height of this polymer portion is specifically between 200 microns and 1.5 millimeters.
4. The IC package of claim 1, wherein the IC package is a ball grid array package.
An integrated circuit (IC) package, which is specifically a ball grid array (BGA) package, features a lid, a package support (e.g., a package substrate or an interposer), and a die situated between them. The lid includes a planar metal portion, from which a separate metal portion extends downwards towards the package support. A polymer portion is arranged such that one end contacts this extending metal portion, and its other end contacts the package support.
6. The IC package of claim 5, wherein the package support includes a package substrate.
An integrated circuit (IC) package includes a lid, a package support, and a die located between them. The package further incorporates a polymer portion and a metal portion, typically part of a lid's foot or rib structure. In this package, the package support is specifically a package substrate.
7. The IC package of claim 5, wherein the package support includes an interposer.
An integrated circuit (IC) package includes a lid, a package support, and a die located between them. The package further incorporates a polymer portion and a metal portion, typically part of a lid's foot or rib structure. In this package, the package support is specifically an interposer.
8. The IC package of claim 5, wherein the height of the polymer portion is greater than a thickness of the die.
An integrated circuit (IC) package includes a lid, a package support, and a die located between them. The package further incorporates a polymer portion and a metal portion, typically part of a lid's foot or rib structure. A key feature is that the height of this polymer portion is greater than the thickness of the die.
9. The IC package of claim 5, wherein the height of the polymer portion is between 200 microns and 1.5 millimeters.
An integrated circuit (IC) package includes a lid, a package support, and a die located between them. The package further incorporates a polymer portion and a metal portion, typically part of a lid's foot or rib structure. The height of this polymer portion is specifically between 200 microns and 1.5 millimeters.
10. The IC package of claim 5, wherein the polymer portion may be stretched up to 300 microns without mechanical failure of the polymer portion.
An integrated circuit (IC) package includes a lid, a package support, and a die located between them. The package further incorporates a polymer portion and a metal portion, typically part of a lid's foot or rib structure. A key characteristic of the polymer portion is its elasticity, allowing it to be stretched up to 300 microns without experiencing mechanical failure.
11. The IC package of claim 1, wherein one end of the polymer portion is in contact with the metal portion that extends from the planar metal portion towards the package support and another end of the polymer portion is in contact with the package support.
An integrated circuit (IC) package comprises a lid, a package support (e.g., a package substrate or an interposer), and a die located between them. The lid has a planar metal portion, from which a separate metal portion extends downwards towards the package support. Crucially, a polymer portion is arranged so that one of its ends directly touches this extending metal portion, while its other end directly contacts the package support, forming a flexible connection.
12. The IC package of claim 2, wherein the metal portion that extends from the planar metal portion towards the package support is materially continuous with the rectangular solid of the planar metal portion.
An integrated circuit (IC) package features a lid, a package support (e.g., a package substrate or an interposer), and a die situated between them. The lid includes a planar metal portion, which is specifically shaped as a rectangular solid. From this rectangular solid, a separate metal portion extends downwards towards the package support. This extending metal portion is materially continuous with the rectangular solid. A polymer portion is arranged such that one end contacts this continuous metal portion, and its other end contacts the package support.
13. The IC package of claim 1, wherein no portion of sidewalls of the polymer portion is in contact with the metal portion of the foot.
An integrated circuit (IC) package features a lid, a package support (e.g., a package substrate or an interposer), and a die situated between them. The lid includes a planar metal portion, from which a separate metal portion (acting as part of a foot) extends downwards towards the package support. A polymer portion is arranged such that one end contacts this extending metal portion, and its other end contacts the package support. A critical design detail is that no portion of the sidewalls of the polymer portion touches the extending metal portion of the foot.
14. The IC package of claim 13, wherein no portion of the metal portion of the foot is in contact with the sidewalls of the polymer portion.
An integrated circuit (IC) package features a lid, a package support (e.g., a package substrate or an interposer), and a die situated between them. The lid includes a planar metal portion, from which a separate metal portion (acting as part of a foot) extends downwards towards the package support. A polymer portion is arranged such that one end contacts this extending metal portion, and its other end contacts the package support. A critical design detail is that no portion of the sidewalls of the polymer portion touches the extending metal portion of the foot, and likewise, no portion of the metal portion of the foot is in contact with the sidewalls of the polymer portion.
15. The IC package of claim 1, wherein no portion of the metal portion of the foot is in contact with sidewalls of the polymer portion.
An integrated circuit (IC) package features a lid, a package support (e.g., a package substrate or an interposer), and a die situated between them. The lid includes a planar metal portion, from which a separate metal portion (acting as part of a foot) extends downwards towards the package support. A polymer portion is arranged such that one end contacts this extending metal portion, and its other end contacts the package support. A key design feature is that no portion of the metal portion of the foot makes contact with the sidewalls of the polymer portion.
16. The IC package of claim 1, wherein the package support is a package substrate.
An integrated circuit (IC) package features a lid, a package support, and a die situated between them. The lid includes a planar metal portion, from which a separate metal portion extends downwards towards the package support. A polymer portion is arranged such that one end contacts this extending metal portion, and its other end contacts the package support. In this configuration, the package support is specifically a package substrate.
17. The IC package of claim 1, wherein the package support is an interposer.
18. The IC package of claim 5, wherein all of the metal portion is further away from the package support than the die.
An integrated circuit (IC) package includes a lid, a package support, and a die located between them. The package further incorporates a polymer portion and a metal portion, typically part of a lid's foot or rib structure. A critical spatial arrangement is that the entirety of the metal portion is situated further away from the package support than the die, effectively placing it closer to the lid than the die is to the package support.
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June 25, 2019
March 19, 2024
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