Embodiments of systems and methods for dicing a bonded structure are provided. A method for dicing a bonded structure includes thinning a top surface and a bottom surface of a bonded structure. The bonded structure may have a first wafer and a second wafer bonded with a bonding interface. The method may also include forming a series of ablation structures in the first wafer and the second wafer. The series of ablation structures may be between a first part and a second part of the bonded structure. The method may also include separating the first part and the second part of the bonded structure along the series of ablation structures.
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3. The method of claim 2, wherein determining the relative positions between the series of ablation structures and the bonding interface comprises determining a first cutting level in the first wafer and a second cutting level in the second wafer of the bonded structure, the first cutting level being a level away from the bonding interface into the first wafer by a first cutting depth along a vertical direction, and the second cutting level being a distance away from the bonding interface into the second wafer by a second cutting depth along the vertical direction.
6. The method of claim 5, wherein converging the laser beam at the first focal plane and at the second focal plane comprises adjusting an arrangement of an optical module to respectively form a series of focused laser spots on the first focal plane and on the second focal plane.
10. The method of claim 1, wherein separating the first part and the second part of the bonded structure comprises applying a lateral force on at least one of the first part or the second part of the bonded structure.
13. The method of claim 1, wherein a first distance from the bonding interface to the first ablation spot is identical to a second distance from the bonding interface to the second ablation spot.
14. The method of claim 13, wherein the first distance, equal to the second distance, is within an arrange of about 20 μm to about 40 μm.
15. The method of claim 1, wherein a first length from a first end of the vertical ablation stripe to the bonding interface is identical to a second length from a second end of the vertical ablation stripe to the bonding interface, the first end and the second end being arranged at two opposite sides of the bonding interface.
19. The method of claim 18, wherein the third ablation spots and the fourth ablation spots are on a one-to-one relationship along a vertical line perpendicular to the bonding interface.
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September 28, 2021
March 26, 2024
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