A package structure includes a first redistribution circuit structure, a second redistribution circuit structure, a semiconductor die, a waveguide structure, and an antenna. The semiconductor die is sandwiched between and electrically coupled to the first redistribution circuit structure and the second redistribution circuit structure. The waveguide structure is located aside and electrically coupled to the semiconductor die, wherein the waveguide structure includes a part of the first redistribution circuit structure, a part of the second redistribution circuit structure and a plurality of first through vias each connecting to the part of the first redistribution circuit structure and the part of the second redistribution circuit structure. The antenna is located on the semiconductor die, wherein the second redistribution circuit structure is sandwiched between the antenna and the semiconductor die, and the antenna is electrically communicated with the semiconductor die through the waveguide structure.
Legal claims defining the scope of protection, as filed with the USPTO.
3. The package structure of claim 2, wherein a shape of the channel comprises a shape in form of a linear line or a shape in form of a curved line having one or more than one bending portions.
13. The package structure of claim 12, wherein the plurality of first conductive pillars and the plurality of second conductive pillars penetrate through the insulating encapsulation and laterally next to each other and to the semiconductor die.
15. The package structure of claim 14, wherein the isolation structure is electrically coupled to the semiconductor die and electrically isolated from the plurality of antennas.
19. The package structure of claim 16, wherein a signal transmitting from the at least one semiconductor die to the antennas or transmitting from the antennas to the at least one semiconductor die is in an electromagnetic wave form propagating inside a channel located in the waveguide structure.
20. The package structure of claim 19, wherein a shape of the channel comprising a shape in form of a linear line or a shape in form of a curved line having one or more than one bending portions.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
October 26, 2020
March 26, 2024
Browse 5M+ US patents with plain-English claim translations and AI-generated analysis.