A package structure includes a first redistribution circuit structure, a second redistribution circuit structure, a semiconductor die, a waveguide structure, and an antenna. The semiconductor die is sandwiched between and electrically coupled to the first redistribution circuit structure and the second redistribution circuit structure. The waveguide structure is located aside and electrically coupled to the semiconductor die, wherein the waveguide structure includes a part of the first redistribution circuit structure, a part of the second redistribution circuit structure and a plurality of first through vias each connecting to the part of the first redistribution circuit structure and the part of the second redistribution circuit structure. The antenna is located on the semiconductor die, wherein the second redistribution circuit structure is sandwiched between the antenna and the semiconductor die, and the antenna is electrically communicated with the semiconductor die through the waveguide structure.
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3. The package structure of claim 2, wherein a shape of the channel comprises a shape in form of a linear line or a shape in form of a curved line having one or more than one bending portions.
The invention relates to a package structure designed to improve heat dissipation and structural integrity in electronic devices. The package structure includes a channel formed within a substrate or housing to facilitate the flow of a cooling medium, such as a liquid or gas, to remove heat from electronic components. The channel is configured to enhance heat transfer efficiency by optimizing its shape and dimensions. In particular, the channel can have a linear or curved configuration, with the curved shape including one or more bending portions to maximize surface area contact with the cooling medium. This design allows for more effective heat dissipation while maintaining structural stability. The package structure may also include additional features, such as a sealing mechanism to prevent leakage of the cooling medium and a support structure to reinforce the channel against mechanical stress. The overall design aims to improve thermal management in high-performance electronic devices, ensuring reliable operation under demanding conditions.
13. The package structure of claim 12, wherein the plurality of first conductive pillars and the plurality of second conductive pillars penetrate through the insulating encapsulation and laterally next to each other and to the semiconductor die.
The invention relates to semiconductor packaging, specifically addressing the challenge of integrating multiple conductive pillars within an insulating encapsulation to enhance electrical connectivity and structural stability. The package structure includes a semiconductor die embedded within an insulating encapsulation. A plurality of first conductive pillars and a plurality of second conductive pillars are embedded within the insulating encapsulation, penetrating through it and positioned laterally adjacent to each other and to the semiconductor die. These conductive pillars provide electrical connections between different layers or components of the package, ensuring efficient signal transmission and power distribution. The arrangement of the pillars next to each other and the semiconductor die optimizes space utilization and minimizes signal interference, improving overall performance. The insulating encapsulation protects the semiconductor die and conductive pillars from environmental damage while maintaining structural integrity. This design is particularly useful in advanced semiconductor packaging, where high-density interconnects are required for compact and high-performance electronic devices.
15. The package structure of claim 14, wherein the isolation structure is electrically coupled to the semiconductor die and electrically isolated from the plurality of antennas.
The invention relates to a package structure for semiconductor devices, particularly addressing challenges in integrating antennas and semiconductor dies while ensuring electrical isolation and signal integrity. The structure includes a semiconductor die, a plurality of antennas, and an isolation structure. The isolation structure is electrically coupled to the semiconductor die but remains electrically isolated from the antennas. This configuration prevents interference between the semiconductor die and the antennas, ensuring reliable signal transmission and reception. The isolation structure may be implemented using conductive or insulating materials, depending on the specific application. The antennas are designed to operate at specific frequencies, and their placement relative to the semiconductor die is optimized to minimize signal degradation. The package structure may also include additional components such as interconnects, substrates, or shielding layers to further enhance performance. The invention is particularly useful in wireless communication devices, radar systems, and other applications requiring high-frequency signal processing. The electrical coupling between the isolation structure and the semiconductor die ensures proper grounding or biasing, while the isolation from the antennas prevents unwanted coupling or noise. This design improves overall system efficiency and reliability.
19. The package structure of claim 16, wherein a signal transmitting from the at least one semiconductor die to the antennas or transmitting from the antennas to the at least one semiconductor die is in an electromagnetic wave form propagating inside a channel located in the waveguide structure.
The invention relates to a package structure for semiconductor devices, particularly focusing on signal transmission between semiconductor dies and antennas. The structure includes a waveguide that forms a channel for propagating electromagnetic waves, enabling efficient signal transmission between the semiconductor die and the antennas. The waveguide structure is designed to guide the electromagnetic waves, ensuring reliable communication while minimizing signal loss and interference. The semiconductor die is integrated within the package, and the antennas are positioned to receive or transmit signals in the form of electromagnetic waves through the waveguide channel. This design improves signal integrity and reduces the need for external connections, enhancing the overall performance and compactness of the semiconductor package. The waveguide structure may include additional features to optimize signal propagation, such as reflective surfaces or dielectric materials, to further enhance transmission efficiency. The invention addresses challenges in high-frequency signal transmission within semiconductor packages, particularly in applications requiring high-speed data transfer or wireless communication.
20. The package structure of claim 19, wherein a shape of the channel comprising a shape in form of a linear line or a shape in form of a curved line having one or more than one bending portions.
The invention relates to a package structure designed to improve heat dissipation and structural integrity in electronic devices. The package structure includes a channel formed within a substrate or housing to facilitate the flow of a cooling medium, such as a liquid or gas, to remove heat from electronic components. The channel can have a linear shape or a curved shape with one or more bending portions, allowing flexibility in design to accommodate different spatial constraints and thermal management requirements. The curved channel with bending portions may enhance heat transfer efficiency by increasing the surface area in contact with the cooling medium. The package structure may also include additional features, such as a sealing mechanism to prevent leakage of the cooling medium and a support structure to maintain mechanical stability. The invention addresses the problem of overheating in electronic devices by providing an efficient and adaptable cooling solution that can be integrated into various package designs. The channel's shape ensures optimal heat dissipation while maintaining structural integrity, making it suitable for high-performance applications.
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October 26, 2020
March 26, 2024
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