Embodiments of substrate supports and process chambers equipped with the same are provided. In some embodiments, a substrate support includes: a support body having a first surface; one or more receptacles extending through the first surface and into the support body; and one or more protrusions respectively disposed within corresponding ones of the one or more receptacles and projecting from the first surface, wherein the one or more protrusions at least partially define a substantially planar support surface above the first surface. Methods of eliminating backside wafer damage are also disclosed.
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2. The substrate support of claim 1, further comprising a seal band disposed around a peripheral edge of the support body.
A substrate support for semiconductor processing includes a support body with a support surface for holding a substrate, such as a semiconductor wafer, during processing. The support body has a plurality of gas passages extending through it to deliver a backside gas to the substrate, ensuring uniform cooling and pressure distribution. The support body also includes a plurality of lift pins that extend through the support surface to lift the substrate for transfer. The lift pins are retractable and can be positioned at different heights to accommodate different substrate sizes. The substrate support further includes a seal band disposed around the peripheral edge of the support body. The seal band forms a gas-tight seal between the support body and the substrate, preventing gas leakage and ensuring proper pressure control during processing. The seal band may be made of a compliant material to accommodate slight variations in substrate flatness and ensure consistent sealing performance. The design helps maintain uniform gas flow and pressure across the substrate, improving process uniformity and yield in semiconductor manufacturing.
3. The substrate support of claim 2, wherein the seal band is coated with a material that reduces a friction coefficient thereof.
A substrate support system for semiconductor processing includes a support structure with a seal band that forms a gas-tight seal with a substrate. The seal band is coated with a low-friction material to minimize resistance during substrate placement and removal. This reduces wear on both the seal band and the substrate, improving durability and processing efficiency. The low-friction coating may include materials such as diamond-like carbon (DLC), polytetrafluoroethylene (PTFE), or other lubricious substances. The seal band is designed to maintain a tight seal while allowing smooth substrate movement, preventing damage to delicate semiconductor wafers. The support structure may also include features like a clamping mechanism or a temperature-controlled surface to enhance substrate handling and processing. The low-friction coating ensures consistent performance over multiple processing cycles, reducing maintenance requirements and downtime. This technology addresses challenges in semiconductor manufacturing where friction-induced damage or seal degradation can lead to defects or reduced yield. The coated seal band improves reliability and extends the lifespan of the substrate support system.
4. The substrate support of claim 1, wherein each of the one or more thermoplastic protrusions include thermoplastic contact points to support the substrate, wherein the thermoplastic contact points are softer than the first surface.
This invention relates to a substrate support system designed to handle delicate substrates, such as semiconductor wafers or glass panels, during manufacturing processes. The problem addressed is the risk of damage to substrates when they are supported by rigid contact points, which can cause scratches, cracks, or other defects due to uneven pressure distribution or thermal expansion mismatches. The substrate support includes a base structure with a first surface that is rigid and provides structural stability. Integrated into this surface are one or more thermoplastic protrusions that extend upward to support the substrate. These protrusions are made of a thermoplastic material that is softer than the first surface, reducing the risk of damage during handling. Each protrusion includes multiple thermoplastic contact points that directly interface with the substrate. The softness of these contact points ensures gentle support, accommodating minor surface irregularities and minimizing stress concentrations. The thermoplastic material may also provide some degree of thermal insulation or shock absorption, further protecting the substrate during temperature changes or mechanical vibrations. The design allows for precise positioning of the substrate while maintaining a damage-free support system.
5. The substrate support of claim 1, wherein the one or more thermoplastic protrusions comprise polyimide thermoplastic, polyether ether ketone thermoplastic, or polybenzimidazole thermoplastic.
This invention relates to a substrate support used in semiconductor manufacturing, particularly for supporting a substrate during processing. The substrate support includes one or more thermoplastic protrusions that contact the substrate to reduce particle generation and improve thermal uniformity. The protrusions are designed to deform under pressure, creating a conformal contact with the substrate to minimize gaps and prevent contamination. The thermoplastic material used for the protrusions must have high thermal stability, chemical resistance, and mechanical durability to withstand the harsh conditions of semiconductor processing environments. The protrusions are made from specific high-performance thermoplastics, including polyimide, polyether ether ketone (PEEK), or polybenzimidazole (PBI). These materials are chosen for their ability to maintain structural integrity at elevated temperatures, resist chemical degradation, and provide consistent mechanical properties over time. The protrusions may be integrated into the substrate support surface or attached as separate components. The use of these thermoplastics ensures reliable performance in high-temperature and chemically aggressive semiconductor fabrication processes, reducing defects and improving yield. The invention addresses the need for durable, contamination-resistant substrate supports that enhance processing efficiency and product quality in semiconductor manufacturing.
7. The process chamber of claim 6, wherein one or more threaded thermoplastic protrusions are detachable from the support body such that they can be coupled to the support body and uncoupled from the support body.
This invention relates to a process chamber with a support body and detachable thermoplastic protrusions. The support body is designed to hold one or more threaded thermoplastic protrusions, which can be easily attached and removed. The protrusions are threaded, allowing them to be securely fastened to the support body when needed and detached when necessary. This modular design enables customization and adaptability of the process chamber for different applications. The thermoplastic material of the protrusions provides flexibility and durability, making them suitable for various industrial processes. The detachable nature of the protrusions allows for easy maintenance, replacement, or reconfiguration of the chamber without requiring significant structural modifications. This feature enhances the versatility and longevity of the process chamber, making it more efficient and cost-effective for users. The invention addresses the need for a process chamber that can be easily adjusted and maintained, improving operational flexibility and reducing downtime.
8. The process chamber of claim 6, wherein the one or more threaded thermoplastic protrusions are softer than the first surface.
A process chamber is designed for handling thermoplastic materials, particularly in applications where controlled deformation or sealing is required. The chamber includes one or more threaded thermoplastic protrusions that engage with a first surface, such as a wall or another component within the chamber. These protrusions are made of a thermoplastic material that is softer than the first surface, allowing them to deform under pressure without damaging the harder surface. This ensures a secure and leak-proof connection while maintaining the integrity of the chamber. The softer protrusions also facilitate easier assembly and disassembly, as they can be threaded into place without requiring excessive force. The design is particularly useful in environments where thermal expansion or contraction occurs, as the softer material can accommodate dimensional changes without compromising the seal. The process chamber may be used in various industrial applications, including chemical processing, food packaging, or medical device manufacturing, where precise control of material flow and containment is critical. The use of thermoplastic protrusions provides a cost-effective and durable solution compared to traditional metal threading, reducing wear and maintenance requirements.
9. The process chamber of claim 6, wherein the substrate support comprises a sealing band coated with a material that reduces a friction coefficient thereof, and wherein the sealing band is disposed around a peripheral edge of the support body for forming a low pressure region between the substantially planar support surface and the first surface when a substrate is disposed upon the substantially planar support surface.
This invention relates to a process chamber for semiconductor manufacturing, specifically addressing the challenge of maintaining a low-pressure seal between a substrate and its support surface during processing. The process chamber includes a substrate support with a support body having a substantially planar support surface for holding a substrate. The support body is configured to form a low-pressure region between the support surface and the substrate's first surface when the substrate is placed on the support. A sealing band is positioned around the peripheral edge of the support body to facilitate this low-pressure region. The sealing band is coated with a material that reduces its friction coefficient, minimizing wear and improving sealing efficiency. The reduced friction coating ensures smooth substrate handling while maintaining an effective seal, which is critical for processes like chemical vapor deposition or etching that require controlled gas flow and pressure conditions. The sealing band's design and coating enhance substrate stability and processing consistency, addressing issues related to substrate movement or gas leakage during high-precision manufacturing steps.
11. The substrate support of claim 10, wherein one or more thermoplastic protrusions are replaceable or detachable from the support body.
A substrate support system is designed to securely hold substrates during manufacturing processes, such as semiconductor fabrication or display panel production. The support ensures precise alignment and stability while preventing damage to the substrate. A key challenge in such systems is maintaining consistent performance over time, as wear or contamination can degrade support accuracy. Additionally, different substrates may require varying support configurations, making adaptability crucial. The invention addresses these issues by incorporating one or more thermoplastic protrusions into the support body. These protrusions provide contact points for the substrate, distributing pressure evenly and minimizing deformation. The thermoplastic material is selected for its durability, thermal stability, and low friction properties, ensuring reliable performance under high-temperature or high-vacuum conditions. A critical feature is that these protrusions are replaceable or detachable from the support body. This allows for easy maintenance, replacement of worn components, or customization of the support configuration for different substrate types. The detachable design also simplifies cleaning and inspection, reducing downtime and improving overall efficiency. The support body itself may include alignment features, such as grooves or recesses, to further enhance substrate positioning accuracy. This modular approach ensures long-term usability and adaptability in various manufacturing environments.
12. The substrate support of claim 10, wherein the one or more thermoplastic protrusions are softer than the first surface.
The invention relates to a substrate support designed for semiconductor processing, particularly addressing the challenge of securely holding delicate substrates during manufacturing while minimizing damage. The support includes a base with a first surface that contacts the substrate, and one or more thermoplastic protrusions extending from the first surface to engage the substrate. These protrusions are softer than the first surface, allowing them to deform under pressure to conform to the substrate's surface, reducing stress concentrations and preventing damage. The protrusions may be arranged in a pattern to distribute contact points evenly across the substrate, ensuring uniform support. The thermoplastic material of the protrusions enables them to soften at elevated temperatures, further enhancing conformability during processing. The support may also include alignment features to position the substrate accurately. This design improves substrate handling in semiconductor fabrication, reducing defects caused by mechanical stress or misalignment.
13. The substrate support of claim 10, wherein the one or more thermoplastic protrusions are made of a thermoplastic material comprising polyimide thermoplastic, polyether ether ketone thermoplastic, or polybenzimidazole thermoplastic.
This invention relates to a substrate support used in semiconductor manufacturing, particularly for supporting a substrate during processing. The substrate support includes one or more thermoplastic protrusions that contact the substrate to reduce particle contamination and improve heat transfer. The protrusions are designed to deform under pressure to create a conformal contact with the substrate, enhancing thermal conductivity and minimizing defects. The thermoplastic material used for the protrusions is selected from polyimide, polyether ether ketone (PEEK), or polybenzimidazole (PBI) due to their high thermal stability, chemical resistance, and mechanical durability. These materials ensure the protrusions maintain structural integrity under high-temperature processing conditions while providing consistent contact with the substrate. The protrusions may be integrated into the substrate support surface or attached as separate components. The invention addresses the challenge of achieving uniform thermal contact between the substrate and support while minimizing contamination, which is critical for high-precision semiconductor fabrication. The use of these specific thermoplastic materials ensures the protrusions can withstand harsh processing environments without degrading, thus improving yield and reliability in semiconductor manufacturing.
14. The substrate support of claim 10, wherein the one or more thermoplastic protrusions have a height of about 25 microns to about 200 microns.
This invention relates to a substrate support used in semiconductor manufacturing, particularly for supporting a substrate during processing. The problem addressed is ensuring precise and stable substrate positioning while minimizing contamination and damage. The substrate support includes a base with one or more thermoplastic protrusions that contact and support the substrate. These protrusions are designed to deform under pressure, providing a conformal contact surface that adapts to the substrate's surface irregularities. The protrusions have a height of approximately 25 to 200 microns, allowing them to compress sufficiently to distribute load evenly and prevent localized stress points. The thermoplastic material is selected for its ability to deform at processing temperatures while maintaining structural integrity. The protrusions may be arranged in a pattern to optimize support and thermal transfer. The base may include channels or recesses to facilitate gas flow, further enhancing stability and reducing particle generation. The design ensures minimal contact area, reducing contamination risks while maintaining substrate alignment. The protrusions may also be coated or treated to improve durability and reduce outgassing. This invention improves substrate handling in processes like etching, deposition, or lithography by providing a stable, low-contamination support system.
15. The substrate support of claim 10, wherein the one or more receptacles are threaded holes.
A substrate support system is designed to securely hold a substrate during processing, such as in semiconductor or display manufacturing. The system addresses the challenge of maintaining precise substrate alignment and stability while allowing for easy attachment and detachment of the substrate. The substrate support includes a base structure with one or more receptacles that engage with corresponding features on the substrate or a substrate carrier. These receptacles are threaded holes, enabling secure fastening via screws or other threaded fasteners. The threaded design ensures a strong, adjustable connection that can accommodate variations in substrate thickness or alignment requirements. The receptacles may be positioned at specific locations to optimize stability and minimize substrate deformation during processing. The system may also include additional alignment features, such as pins or guides, to ensure accurate positioning. The threaded receptacles allow for quick disassembly and reassembly, improving efficiency in automated or high-throughput manufacturing environments. The design is particularly useful in applications where precise substrate handling is critical, such as in lithography, etching, or deposition processes.
16. The substrate support of claim 15, wherein the one or more thermoplastic protrusions include threads to mate with the threaded holes.
A substrate support system is designed to securely hold a substrate, such as a semiconductor wafer, during processing. The system addresses the challenge of maintaining precise alignment and stability while allowing for easy attachment and detachment of the substrate. The support includes a base structure with one or more thermoplastic protrusions that engage with corresponding holes in the substrate. These protrusions are designed to deform under heat and pressure, creating a secure mechanical interlock with the substrate. The protrusions may include threads that mate with threaded holes in the substrate, ensuring a strong and precise connection. The thermoplastic material allows for reversible bonding, enabling repeated use without damaging the substrate. The system ensures accurate positioning and minimizes misalignment during processing, improving manufacturing yield and efficiency. The threaded design enhances the mechanical strength of the connection, reducing the risk of substrate displacement during handling or processing. The use of thermoplastic materials also allows for thermal expansion and contraction, accommodating variations in processing conditions. This approach provides a reliable and cost-effective solution for substrate handling in semiconductor and other precision manufacturing applications.
17. The substrate support of claim 10, wherein the one or more thermoplastic protrusions are a plurality of protrusions arranged about the support body.
This invention relates to a substrate support designed for semiconductor processing, addressing the challenge of securely holding substrates during high-temperature operations while minimizing contamination and thermal stress. The support features a support body with one or more thermoplastic protrusions that engage the substrate. These protrusions are arranged in a plurality around the support body to evenly distribute contact points, reducing localized stress and improving thermal uniformity. The thermoplastic material ensures compatibility with high-temperature processes, preventing degradation or contamination. The protrusions may be positioned at specific intervals or patterns to optimize substrate stability and alignment. The support body itself may include additional features, such as channels or recesses, to enhance cooling or gas flow during processing. The design ensures precise substrate positioning while accommodating thermal expansion, making it suitable for advanced semiconductor manufacturing where precision and contamination control are critical. The arrangement of multiple protrusions minimizes direct contact area, reducing particle generation and improving process yield.
18. The substrate support of claim 10, wherein the one or more thermoplastic protrusions comprise polybenzimidazole thermoplastic, and wherein the first surface comprises stainless steel.
This invention relates to a substrate support used in semiconductor manufacturing, particularly for handling substrates at high temperatures. The problem addressed is the need for durable, heat-resistant supports that can withstand extreme thermal conditions while maintaining precise substrate positioning and minimizing contamination. The substrate support includes a base structure with a first surface designed to interface with a substrate. The first surface is made of stainless steel, providing corrosion resistance and structural stability. The support also features one or more thermoplastic protrusions that extend from the first surface to engage the substrate. These protrusions are made of polybenzimidazole (PBI) thermoplastic, a high-performance polymer known for its exceptional thermal stability, chemical resistance, and mechanical strength. The PBI protrusions ensure secure substrate placement while preventing damage from thermal expansion or mechanical stress. The design allows the support to operate in high-temperature environments, such as those encountered in semiconductor processing, without degrading or contaminating the substrate. The combination of stainless steel and PBI ensures long-term reliability and precise substrate alignment, addressing challenges in thermal management and contamination control in advanced manufacturing processes.
19. The substrate support of claim 10, wherein the one or more thermoplastic protrusions comprise polybenzimidazole thermoplastic, and wherein the first surface comprises quartz, ceramic, or metal.
This invention relates to a substrate support used in semiconductor manufacturing, particularly for supporting a substrate during high-temperature processes. The problem addressed is the need for durable, thermally stable, and chemically resistant protrusions on the substrate support to prevent substrate damage while maintaining precise positioning. The substrate support includes one or more thermoplastic protrusions that contact the substrate. These protrusions are made of polybenzimidazole (PBI), a high-performance thermoplastic known for its thermal stability, chemical resistance, and mechanical strength. The protrusions are integrated into a first surface of the support, which is made of quartz, ceramic, or metal. These materials are chosen for their compatibility with semiconductor processing environments, ensuring minimal contamination and long-term durability. The protrusions provide controlled contact points to minimize substrate deformation and ensure uniform heat distribution during processes like chemical vapor deposition (CVD) or physical vapor deposition (PVD). The use of PBI ensures the protrusions maintain their structural integrity at elevated temperatures, while the quartz, ceramic, or metal base provides structural rigidity and thermal conductivity. This combination enhances process reliability and substrate yield in semiconductor fabrication.
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September 13, 2017
April 9, 2024
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