Embodiments of substrate supports and process chambers equipped with the same are provided. In some embodiments, a substrate support includes: a support body having a first surface; one or more receptacles extending through the first surface and into the support body; and one or more protrusions respectively disposed within corresponding ones of the one or more receptacles and projecting from the first surface, wherein the one or more protrusions at least partially define a substantially planar support surface above the first surface. Methods of eliminating backside wafer damage are also disclosed.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The substrate support of claim 1, further comprising a seal band disposed around a peripheral edge of the support body.
3. The substrate support of claim 2, wherein the seal band is coated with a material that reduces a friction coefficient thereof.
4. The substrate support of claim 1, wherein each of the one or more thermoplastic protrusions include thermoplastic contact points to support the substrate, wherein the thermoplastic contact points are softer than the first surface.
5. The substrate support of claim 1, wherein the one or more thermoplastic protrusions comprise polyimide thermoplastic, polyether ether ketone thermoplastic, or polybenzimidazole thermoplastic.
7. The process chamber of claim 6, wherein one or more threaded thermoplastic protrusions are detachable from the support body such that they can be coupled to the support body and uncoupled from the support body.
8. The process chamber of claim 6, wherein the one or more threaded thermoplastic protrusions are softer than the first surface.
9. The process chamber of claim 6, wherein the substrate support comprises a sealing band coated with a material that reduces a friction coefficient thereof, and wherein the sealing band is disposed around a peripheral edge of the support body for forming a low pressure region between the substantially planar support surface and the first surface when a substrate is disposed upon the substantially planar support surface.
11. The substrate support of claim 10, wherein one or more thermoplastic protrusions are replaceable or detachable from the support body.
12. The substrate support of claim 10, wherein the one or more thermoplastic protrusions are softer than the first surface.
13. The substrate support of claim 10, wherein the one or more thermoplastic protrusions are made of a thermoplastic material comprising polyimide thermoplastic, polyether ether ketone thermoplastic, or polybenzimidazole thermoplastic.
14. The substrate support of claim 10, wherein the one or more thermoplastic protrusions have a height of about 25 microns to about 200 microns.
15. The substrate support of claim 10, wherein the one or more receptacles are threaded holes.
16. The substrate support of claim 15, wherein the one or more thermoplastic protrusions include threads to mate with the threaded holes.
17. The substrate support of claim 10, wherein the one or more thermoplastic protrusions are a plurality of protrusions arranged about the support body.
18. The substrate support of claim 10, wherein the one or more thermoplastic protrusions comprise polybenzimidazole thermoplastic, and wherein the first surface comprises stainless steel.
19. The substrate support of claim 10, wherein the one or more thermoplastic protrusions comprise polybenzimidazole thermoplastic, and wherein the first surface comprises quartz, ceramic, or metal.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
September 13, 2017
April 9, 2024
Browse 5M+ US patents with plain-English claim translations and AI-generated analysis.