Embodiments of the invention include molded modules and methods for forming molded modules. According to an embodiment the molded modules may be integrated into an electrical package. Electrical packages according to embodiments of the invention may include a die with a redistribution layer formed on at least one surface. The molded module may be mounted to the die. According to an embodiment, the molded module may include a mold layer and a plurality of components encapsulated within the mold layer. Terminals from each of the components may be substantially coplanar with a surface of the mold layer in order to allow the terminals to be electrically coupled to the redistribution layer on the die. Additional embodiments of the invention may include one or more through mold vias formed in the mold layer to provide power delivery and/or one or more faraday cages around components.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The package of claim 1, wherein the terminals are substantially coplanar with the first surface of the mold layer.
3. The package of claim 1, wherein the terminals are electrically coupled to the redistribution layer with solder bumps.
4. The package of claim 1, wherein the terminals are electrically coupled to the redistribution layer with an anisotropic film or paste.
6. The package of claim 5, wherein the module is between the die and the package substrate.
8. The package of claim 5, wherein the first level interconnects are wire bonds.
9. The package of claim 8, wherein the die is between the module and the package substrate.
15. The system of claim 10, wherein the terminals are substantially coplanar with the first surface of the mold layer.
16. The system of claim 10, wherein the terminals are electrically coupled to the redistribution layer with solder bumps.
17. The system of claim 10, wherein the terminals are electrically coupled to the redistribution layer with an anisotropic film or paste.
19. The system of claim 18, wherein the module is between the die and the package substrate.
21. The system of claim 18, wherein the first level interconnects are wire bonds.
22. The system of claim 21, wherein the die is between the module and the package substrate.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
July 8, 2022
April 9, 2024
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