Embodiments of the invention include molded modules and methods for forming molded modules. According to an embodiment the molded modules may be integrated into an electrical package. Electrical packages according to embodiments of the invention may include a die with a redistribution layer formed on at least one surface. The molded module may be mounted to the die. According to an embodiment, the molded module may include a mold layer and a plurality of components encapsulated within the mold layer. Terminals from each of the components may be substantially coplanar with a surface of the mold layer in order to allow the terminals to be electrically coupled to the redistribution layer on the die. Additional embodiments of the invention may include one or more through mold vias formed in the mold layer to provide power delivery and/or one or more faraday cages around components.
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
2. The package of claim 1, wherein the terminals are substantially coplanar with the first surface of the mold layer.
This invention relates to semiconductor packaging, specifically addressing the challenge of achieving reliable electrical connections in integrated circuit (IC) packages while maintaining compact form factors. The package includes a mold layer with a first surface, a semiconductor die embedded within the mold layer, and multiple terminals electrically connected to the die. The terminals are positioned such that they are substantially coplanar with the first surface of the mold layer, ensuring a flat and uniform interface for subsequent assembly processes. This coplanarity simplifies mounting the package onto a circuit board or other substrates, improving manufacturing efficiency and connection reliability. The terminals may be formed using conductive materials such as metal, and their coplanar arrangement minimizes height variations, reducing the risk of misalignment or poor contact during assembly. The package may also include additional features, such as conductive vias or redistribution layers, to enhance electrical performance and connectivity. The overall design aims to optimize space utilization while ensuring robust electrical and mechanical integrity in high-density electronic applications.
3. The package of claim 1, wherein the terminals are electrically coupled to the redistribution layer with solder bumps.
The invention relates to semiconductor packaging, specifically addressing the challenge of efficiently connecting terminals of a semiconductor device to a redistribution layer (RDL) in a compact and reliable manner. The package includes a semiconductor die with terminals that are electrically coupled to an RDL using solder bumps. The RDL redistributes electrical signals from the terminals to external connection points, such as solder balls or pins, enabling integration with a circuit board or other electronic components. The solder bumps provide a robust mechanical and electrical connection between the terminals and the RDL, ensuring signal integrity and thermal dissipation. The package may also include an encapsulant to protect the semiconductor die and the RDL from environmental factors. The use of solder bumps allows for fine-pitch connections, supporting high-density interconnects in advanced semiconductor devices. This design is particularly useful in applications requiring miniaturization, such as mobile devices, IoT sensors, and high-performance computing systems. The invention improves upon traditional wire-bonding or flip-chip techniques by offering a more scalable and cost-effective solution for high-density interconnects.
4. The package of claim 1, wherein the terminals are electrically coupled to the redistribution layer with an anisotropic film or paste.
This invention relates to electronic packaging, specifically addressing the challenge of efficiently connecting terminals of a semiconductor device to a redistribution layer (RDL) in a compact and reliable manner. The invention describes a package structure where terminals, such as bond pads or solder bumps, are electrically coupled to the RDL using an anisotropic conductive film (ACF) or anisotropic conductive paste (ACP). These materials enable selective electrical connections in the vertical direction while preventing lateral conduction, ensuring precise signal routing without short circuits. The anisotropic film or paste contains conductive particles that align under pressure, forming conductive pathways only where terminals contact the RDL. This method simplifies assembly, reduces the need for complex alignment processes, and improves reliability in high-density interconnect applications. The package may include additional features such as an encapsulant to protect the connections and a substrate supporting the RDL. The use of ACF or ACP allows for fine-pitch connections, making it suitable for advanced semiconductor packages, including those used in mobile devices, high-performance computing, and other applications requiring miniaturization and high reliability.
6. The package of claim 5, wherein the module is between the die and the package substrate.
The invention relates to semiconductor packaging, specifically addressing the challenge of improving thermal management and electrical performance in integrated circuit (IC) packages. Traditional IC packages often suffer from inefficient heat dissipation and signal integrity issues due to the direct placement of the die on the package substrate. This can lead to overheating and degraded performance. The invention describes a semiconductor package where a module is positioned between the die and the package substrate. The module serves as an intermediary layer that enhances thermal conductivity, reducing heat buildup in the die. Additionally, the module may include passive or active components that improve signal routing, power distribution, or electromagnetic interference (EMI) shielding. The module can be a redistribution layer (RDL), an interposer, or a thermal interface material (TIM) with embedded circuitry. By inserting this module, the package achieves better thermal dissipation, improved electrical performance, and potentially reduced manufacturing complexity compared to direct die-to-substrate bonding. The module may also facilitate higher-density interconnects, enabling more advanced packaging designs. This configuration is particularly useful in high-performance computing, RF applications, and power electronics where thermal and electrical efficiency are critical.
8. The package of claim 5, wherein the first level interconnects are wire bonds.
The invention relates to semiconductor packaging, specifically addressing the challenge of efficiently connecting integrated circuits (ICs) to external components. Traditional packaging methods often suffer from limitations in electrical performance, thermal management, and manufacturing complexity. This invention improves upon prior art by incorporating wire bonds as the first level interconnects within a semiconductor package. Wire bonds are thin conductive wires that electrically connect the IC die to the package substrate or lead frame, providing a reliable and cost-effective connection method. The package may also include additional features such as a heat spreader for thermal dissipation, an encapsulant for mechanical protection, and a second level of interconnects (e.g., solder balls) for board-level assembly. The use of wire bonds ensures high electrical conductivity, flexibility in design, and compatibility with various packaging technologies. This approach enhances signal integrity, reduces manufacturing costs, and improves overall package reliability. The invention is particularly useful in applications requiring high-performance interconnects, such as consumer electronics, automotive systems, and telecommunications devices.
9. The package of claim 8, wherein the die is between the module and the package substrate.
A semiconductor package includes a die positioned between a module and a package substrate. The module is electrically connected to the die, and the die is electrically connected to the package substrate. The module may include a plurality of components, such as integrated circuits, passive devices, or other electronic elements, mounted on a substrate or interposer. The package substrate provides structural support and electrical connections to external systems. The die serves as an intermediary, facilitating signal routing and power distribution between the module and the package substrate. This configuration allows for efficient integration of multiple components while maintaining reliable electrical and thermal performance. The package may also include additional features, such as thermal management structures, to enhance heat dissipation and improve overall system reliability. The arrangement ensures compact packaging, high-density interconnects, and optimized signal integrity, making it suitable for advanced electronic devices requiring high performance and miniaturization.
15. The system of claim 10, wherein the terminals are substantially coplanar with the first surface of the mold layer.
The invention relates to a system for manufacturing semiconductor devices, specifically addressing the challenge of achieving precise alignment and electrical connectivity between terminals and a mold layer in semiconductor packaging. The system includes a mold layer with a first surface and a second surface, where the second surface has a cavity. A semiconductor die is placed within the cavity, and terminals are positioned on the first surface of the mold layer. The terminals are substantially coplanar with the first surface, ensuring a flat and uniform interface for subsequent processing steps, such as bonding or interconnect formation. This coplanarity minimizes misalignment and improves electrical performance by reducing signal integrity issues caused by uneven surfaces. The system may also include an adhesive layer between the semiconductor die and the mold layer to enhance mechanical stability. The terminals are electrically connected to the semiconductor die, either directly or through intermediate conductive structures, facilitating efficient signal transmission. The invention aims to improve the reliability and manufacturability of semiconductor packages by ensuring precise terminal placement and alignment.
16. The system of claim 10, wherein the terminals are electrically coupled to the redistribution layer with solder bumps.
The invention relates to semiconductor packaging, specifically addressing the challenge of reliable electrical connections between terminals and redistribution layers in integrated circuits. The system includes a semiconductor device with terminals that are electrically coupled to a redistribution layer using solder bumps. The redistribution layer redistributes electrical signals from the terminals to other components, such as external connectors or other layers within the package. The solder bumps provide a robust mechanical and electrical connection, ensuring signal integrity and thermal management. The terminals may be part of a die or an interposer, and the redistribution layer may include conductive traces and insulating layers to route signals efficiently. The system may also incorporate underfill material between the terminals and the redistribution layer to enhance structural stability and prevent delamination. This design improves reliability, reduces signal loss, and supports high-density interconnects in advanced semiconductor packaging.
17. The system of claim 10, wherein the terminals are electrically coupled to the redistribution layer with an anisotropic film or paste.
The invention relates to electronic packaging systems, specifically addressing the challenge of reliably connecting terminals to a redistribution layer in semiconductor devices. The system includes a substrate with terminals that are electrically coupled to a redistribution layer using an anisotropic conductive film or paste. This conductive material ensures precise electrical connections while preventing short circuits between adjacent terminals. The redistribution layer redistributes electrical signals from the terminals to other components, such as integrated circuits or external connectors, enabling efficient signal routing and compact device design. The anisotropic film or paste provides selective conductivity in the vertical direction, allowing for fine-pitch connections without lateral conduction. This solution is particularly useful in high-density interconnect applications where traditional soldering methods may fail due to spacing constraints. The system may also include additional features like underfill material to enhance mechanical stability and thermal management layers to dissipate heat generated during operation. The overall design improves manufacturing yield and device reliability by ensuring consistent electrical performance and mechanical robustness.
19. The system of claim 18, wherein the module is between the die and the package substrate.
A system for electronic device packaging addresses the challenge of thermal management and signal integrity in high-performance integrated circuits. The system includes a module positioned between a semiconductor die and a package substrate to enhance thermal dissipation and electrical performance. The module integrates heat-spreading materials and electrical interconnects to improve heat transfer from the die to the package while maintaining signal integrity. The module may also include passive or active components, such as thermal interface materials, heat spreaders, or signal conditioning circuits, to optimize thermal and electrical performance. By placing the module between the die and the package substrate, the system reduces thermal resistance and minimizes signal degradation, enabling higher performance and reliability in advanced electronic devices. The module can be customized for specific applications, such as high-power processors or RF circuits, to address varying thermal and electrical requirements. This configuration allows for efficient heat dissipation and improved signal transmission, addressing limitations in traditional packaging designs.
21. The system of claim 18, wherein the first level interconnects are wire bonds.
A system for electronic device interconnects addresses the challenge of efficiently connecting multiple semiconductor components within a package. The system includes a first level of interconnects that physically and electrically couple a semiconductor die to a substrate, and a second level of interconnects that couple the substrate to a circuit board. The first level interconnects are wire bonds, which provide flexible and reliable electrical connections between the die and the substrate. Wire bonding is a well-established technique that uses thin conductive wires, typically made of gold, copper, or aluminum, to form connections between bond pads on the die and corresponding pads on the substrate. This method allows for fine-pitch connections, high reliability, and cost-effective manufacturing. The second level interconnects may include solder balls, pins, or other connection technologies to interface with the circuit board. The system ensures robust signal integrity, thermal management, and mechanical stability, making it suitable for high-performance applications such as microprocessors, memory modules, and power electronics. The use of wire bonds in the first level interconnects simplifies the assembly process and reduces the risk of defects compared to alternative methods like flip-chip bonding.
22. The system of claim 21, wherein the die is between the module and the package substrate.
A system for electronic device packaging addresses the challenge of integrating semiconductor dies with module substrates and package substrates while optimizing thermal performance and electrical connectivity. The system includes a module substrate with a die attached to it, and a package substrate connected to the module substrate. The die is positioned between the module and package substrates, allowing for direct thermal and electrical pathways. This configuration enhances heat dissipation by placing the die closer to the package substrate, which may include cooling structures. The module substrate provides structural support and electrical routing, while the package substrate interfaces with external components. The die is electrically coupled to both substrates, enabling efficient signal transmission. The system may also include interconnects, such as solder bumps or conductive pillars, to ensure reliable connections. This arrangement reduces thermal resistance and improves overall device performance by minimizing signal delays and thermal gradients. The system is particularly useful in high-performance computing and power electronics, where thermal management and signal integrity are critical.
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July 8, 2022
April 9, 2024
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