A compact inverter system includes a bus bar. The bus bar includes a terminal for connection to a positive terminal of a DC voltage supply. The compact inverter also includes a heat sink, a first transistor, and a second transistor. The first transistor has first and second terminals between which current is transmitted when the first transistor is activated, and a first gate terminal controlling the first transistor. The first terminal of the first transistor is thermally and electrically connected to the bus bar. The second transistor has first and second terminals between which current is transmitted when the second transistor is activated, and a second gate terminal controlling the second transistor. The first terminal of the second transistor is thermally and electrically connected to the heat sink. The first and second transistors are positioned between the bus bar and the heat sink. The first transistor is positioned between the second transistor and the bus bar. The second transistor is positioned between the first transistor and the heat sink.
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
6. The power inverter of claim 5 wherein the cylindrical channel comprises a wall, and wherein the solid dielectric layer contacts the wall.
A power inverter system includes a cylindrical channel with a wall, where a solid dielectric layer is in contact with the wall. The dielectric layer provides electrical insulation and thermal management within the inverter. The inverter converts direct current (DC) to alternating current (AC) and may include a housing with cooling features to dissipate heat generated during operation. The cylindrical channel may be part of a heat exchanger or a structural component that supports electrical components. The solid dielectric layer ensures safe operation by preventing electrical shorts while maintaining thermal conductivity. The system may also include control circuitry to regulate the conversion process, ensuring stable output voltage and frequency. The design improves efficiency and reliability by integrating insulation and cooling functions within the inverter structure. This configuration is particularly useful in high-power applications where thermal and electrical isolation are critical. The dielectric layer may be made of materials such as ceramic or polymer composites, chosen for their insulating properties and thermal stability. The overall system enhances performance by reducing component stress and improving longevity.
7. The power inverter of claim 4 wherein the first and second transistors are positioned in first and second planes, respectively, and wherein the first and second planes are parallel to each other and positioned between the bus bar and the first heat sink.
This invention relates to power inverters, specifically addressing thermal management and spatial efficiency in high-power electronic systems. The invention improves upon prior art by optimizing the arrangement of transistors and heat dissipation components to reduce thermal resistance and improve cooling efficiency. The power inverter includes a bus bar for distributing electrical power, a first heat sink for dissipating heat, and first and second transistors positioned in separate parallel planes. The first transistor is in a first plane, and the second transistor is in a second plane, with both planes positioned between the bus bar and the first heat sink. This arrangement ensures that the transistors are thermally coupled to the heat sink while maintaining electrical connectivity through the bus bar. The parallel-plane configuration minimizes thermal resistance by reducing the distance between the transistors and the heat sink, enhancing heat dissipation. Additionally, the bus bar's positioning above the transistors allows for efficient power distribution while keeping the overall structure compact. The invention is particularly useful in high-power applications where thermal management and space constraints are critical, such as in electric vehicle drivetrains or industrial power systems. The design ensures reliable operation by preventing overheating while maintaining high power density.
8. The power inverter of claim 7 wherein no dielectric exists between the first terminal of the first transistor and the bus bar, and no dielectric exists between the first terminal of the second transistor and the first heat sink.
A power inverter system addresses the challenge of efficiently converting direct current (DC) to alternating current (AC) while minimizing energy losses and thermal management issues. The invention focuses on improving electrical and thermal conductivity in the inverter's power stage by eliminating dielectric materials in critical connections. The system includes a first transistor and a second transistor, each with a first terminal connected to a bus bar and a first heat sink, respectively. The first terminal of the first transistor is directly coupled to the bus bar without any intervening dielectric material, ensuring low-resistance electrical conduction and efficient heat dissipation. Similarly, the first terminal of the second transistor is directly connected to the first heat sink, eliminating dielectric barriers to enhance thermal transfer. This design reduces parasitic losses, improves power density, and simplifies manufacturing by removing insulating layers that traditionally isolate conductive components. The transistors may be part of a switching circuit that modulates DC input to produce AC output, with the heat sink providing cooling for high-power operation. The absence of dielectrics in these connections ensures optimal performance in high-efficiency inverter applications, such as renewable energy systems or electric vehicle power conversion.
10. The power inverter of claim 9 wherein the first transistor, the second transistor, the third transistor, the fourth transistor and the bus bar are positioned between the first and second heat sinks.
This invention relates to power inverters, specifically addressing thermal management and structural integration in high-power electronic systems. The device includes a power inverter circuit with multiple transistors and a bus bar, all positioned between two heat sinks. The transistors are arranged to facilitate efficient heat dissipation while maintaining electrical connectivity. The first and second transistors form a first switching pair, while the third and fourth transistors form a second switching pair, enabling bidirectional current flow and voltage conversion. The bus bar provides a low-inductance electrical connection between the transistors, reducing switching losses and improving efficiency. The heat sinks are thermally coupled to the transistors and bus bar to dissipate heat generated during operation. This configuration optimizes thermal performance by sandwiching the active components between the heat sinks, ensuring uniform cooling and minimizing thermal stress. The design is particularly suited for high-power applications where thermal management is critical, such as in electric vehicle drives, renewable energy systems, and industrial power supplies. The invention improves reliability and efficiency by integrating thermal and electrical functions in a compact, thermally balanced structure.
15. The power inverter of claim 14 wherein the first transistor, the second transistor, the third transistor, the fourth transistor and the bus bar are positioned between the first and second heat sinks.
This invention relates to power inverters, specifically addressing thermal management and electrical isolation in high-power inverter systems. The device includes a power inverter circuit with multiple transistors and a bus bar positioned between two heat sinks. The transistors and bus bar are arranged to facilitate efficient heat dissipation while maintaining electrical isolation between components. The first and second transistors are typically high-side and low-side switching devices, while the third and fourth transistors may serve as auxiliary or additional switching elements. The bus bar provides a conductive path for power distribution, and its placement between the heat sinks ensures balanced thermal distribution. The heat sinks are designed to dissipate heat generated during operation, preventing overheating and ensuring reliable performance. The arrangement minimizes thermal resistance and improves overall system efficiency by optimizing heat flow paths. This configuration is particularly useful in high-power applications where thermal management is critical, such as in electric vehicle drivetrains or industrial power systems. The invention enhances reliability and performance by integrating thermal and electrical isolation features into a compact design.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
March 4, 2021
April 23, 2024
Browse 5M+ US patents with plain-English claim translations and AI-generated analysis.