Patentable/Patents/US-11971759
US-11971759

Computer tower architecture thermal management

PublishedApril 30, 2024
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

An electronic device can include a housing that defines an internal volume. The electronic device can also include a component within the internal volume that divides the internal volume into a first volume and a second volume. The first volume and second volume can be fluidically isolated except at an aperture defined by the component. An air-moving system can produce a positive air pressure in the first volume and a negative air pressure in the second volume.

Patent Claims
14 claims

Legal claims defining the scope of protection, as filed with the USPTO.

2

2. The electronic device of claim 1, further comprising a seal disposed at an engagement surface of the logic board, the seal contacting a surface of the housing to substantially fluidically isolate the first zone from the second zone, except at the aperture.

4

4. The electronic device of claim 3, wherein the first air-moving apparatus comprises a first fan, a second fan disposed above the first fan, and a third fan disposed above the second fan.

5

5. The electronic device of claim 4, the first fan having a first height, the second fan having a second height, and the third fan having third height, wherein the first height, second height, and third height combined are substantially equal to an entire height of the housing.

6

6. The electronic device of claim 5, wherein the first surface is positioned opposite the second surface.

7

7. The electronic device of claim 1, wherein the second electronic component is disposed at the aperture.

8

8. The electronic device of claim 1, where the first electronic component comprises a power supply unit.

9

9. The electronic device of claim 1, wherein the internal volume substantially consists of the first zone and the second zone.

11

11. The electronic device of claim 10, wherein the first air-moving apparatus is disposed in the first internal volume.

12

12. The electronic device of claim 10, wherein the first air-moving apparatus comprises one or more fans.

13

13. The electronic device of claim 10, wherein the second air-moving apparatus is disposed in the second internal volume.

14

14. The electronic device of claim 10, wherein the second air-moving apparatus comprises a blower.

15

15. The electronic device of claim 10, wherein the computing component comprises a logic board.

16

16. The electronic device of claim 10, further comprising a seal disposed around at least a portion of a periphery of the computing component.

18

18. The electronic device of claim 17, further comprising a seal disposed on an engagement surface of the logic board and contacting an opposite surface of the housing to fluidically isolate the first zone from the second zone, except at the aperture.

Classification Codes (CPC)

Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.

Patent Metadata

Filing Date

April 20, 2022

Publication Date

April 30, 2024

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Cite as: Patentable. “Computer tower architecture thermal management” (US-11971759). https://patentable.app/patents/US-11971759

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