A substrate transport system includes a carrier having a housing forming an interior environment having an opening for holding at least one substrate and a door for sealing the opening from an outside atmosphere where when sealed the interior environment is configured to maintain an interior atmosphere therein, the housing including a fluid reservoir exterior to the interior environment and configured to contain a fluid, forming a different atmosphere in the fluid reservoir than the interior atmosphere, to form a fluidic barrier seal that seals the interior environment from an environment exterior to the carrier.
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2. The substrate processing tool of claim 1, wherein the substrate carrier to processing tool interface module is connected to the load lock.
A substrate processing tool is designed to handle and process substrates, such as semiconductor wafers, in a controlled environment. The tool includes a substrate carrier to processing tool interface module that facilitates the transfer of substrates between a substrate carrier and the processing tool. This interface module is directly connected to a load lock, which is a vacuum chamber used to transition substrates between atmospheric and vacuum environments without contaminating the processing tool. The load lock ensures that substrates are properly sealed and pressurized before entering the processing chamber, maintaining the integrity of the processing environment. The interface module may include mechanisms for aligning, securing, and transferring substrates, ensuring precise and efficient handling. The connection between the interface module and the load lock allows for seamless substrate transfer, reducing contamination risks and improving processing efficiency. This design is particularly useful in semiconductor manufacturing, where maintaining a clean and controlled environment is critical for producing high-quality substrates.
3. The substrate processing tool of claim 1, wherein the atmospheric processing chamber comprises a mini-environment wherein the substrate carrier to processing tool interface module is connected to the mini-environment.
A substrate processing tool is designed for handling and processing substrates, such as semiconductor wafers, in a controlled environment. The tool includes an atmospheric processing chamber that maintains a clean, controlled atmosphere to prevent contamination during substrate handling. The chamber features a mini-environment, which is a localized, highly controlled space that isolates the substrate from external contaminants. This mini-environment is connected to a substrate carrier to processing tool interface module, which facilitates the transfer of substrates between the carrier and the processing tool. The interface module ensures that substrates are moved into and out of the mini-environment without exposing them to uncontrolled ambient conditions. The mini-environment may include features such as air filtration, temperature control, and humidity regulation to maintain optimal processing conditions. The substrate carrier to processing tool interface module may incorporate mechanisms for aligning, securing, or positioning the substrate during transfer, ensuring precise and contamination-free handling. This design improves substrate yield and quality by minimizing exposure to contaminants during processing.
4. The substrate processing tool of claim 1, wherein the atmospheric processing chamber comprises a mini-environment where the substrate carrier to processing tool interface module is connected to both the load lock and the mini-environment.
A substrate processing tool is designed for handling and processing substrates in a controlled environment. The tool addresses challenges in maintaining cleanliness and minimizing contamination during substrate transfer between different processing modules. The system includes an atmospheric processing chamber that operates as a mini-environment, providing a controlled space for substrate handling. This mini-environment is connected to both a load lock and a substrate carrier to processing tool interface module. The load lock facilitates the transfer of substrates between the mini-environment and external environments, while the interface module ensures seamless integration with substrate carriers. The mini-environment maintains a controlled atmosphere, reducing particle contamination and improving process consistency. The design allows for efficient substrate movement while preserving the integrity of the processing environment, enhancing yield and reliability in semiconductor or similar manufacturing processes. The system is particularly useful in applications requiring high-purity conditions, such as semiconductor fabrication, where contamination control is critical.
5. The substrate processing tool of claim 1, wherein the substrate carrier to processing tool interface module is configured to evacuate or charge a substrate carrier fluidic barrier seal located between a door of the substrate carrier and a housing of the substrate carrier.
This invention relates to substrate processing tools, specifically systems for handling and processing semiconductor wafers or similar substrates. The technology addresses challenges in maintaining clean and controlled environments during substrate transfer between a substrate carrier and a processing tool. A key issue is preventing contamination or particle ingress when the carrier door is opened to access the substrate, as gaps or seals between the carrier and tool can allow unwanted particles or gases to enter. The invention includes a substrate carrier to processing tool interface module that actively manages the seal between the carrier door and the carrier housing. This module is designed to either evacuate or charge a fluidic barrier seal located at this interface. Evacuation removes air or gas from the seal area, creating a vacuum that helps maintain a tight, contamination-resistant barrier. Alternatively, the module can charge the seal by introducing a controlled fluid (such as gas or liquid) to enhance sealing performance. This dynamic control of the seal ensures a reliable, contamination-free transfer environment, improving yield and reliability in semiconductor manufacturing processes. The system may integrate with existing carrier designs and processing tools, offering flexibility in implementation.
6. The substrate processing tool of claim 1, wherein the substrate carrier to processing tool interface module is configured to evacuate or charge an internal environment of the substrate carrier.
This invention relates to substrate processing tools, specifically addressing the challenge of maintaining controlled environments during substrate transfer between a substrate carrier and a processing tool. The system includes a substrate carrier to processing tool interface module designed to manage the internal environment of the substrate carrier. This module can evacuate or charge the carrier's interior, allowing for precise control over atmospheric conditions such as pressure, gas composition, or contamination levels. The evacuation function removes unwanted gases or particles, while the charging function introduces specific gases or pressures to prepare the substrate for processing. This ensures that substrates are transferred in a controlled environment, minimizing exposure to contaminants or undesirable atmospheric conditions. The interface module may include valves, pumps, or gas supply systems to achieve these functions. The invention improves substrate processing efficiency and yield by maintaining optimal conditions during transfer, reducing defects and enhancing process consistency.
7. The substrate processing tool of claim 1, wherein the substrate carrier to processing tool interface module is configured to form a pass-through load lock connected to the load lock chamber and the atmospheric processing chamber, the substrate carrier to processing tool interface module having substrate support shelves disposed underneath one of the at least one closable opening.
This invention relates to substrate processing tools, specifically addressing the challenge of efficiently transferring substrates between atmospheric and vacuum environments in semiconductor or similar manufacturing processes. The system includes a substrate carrier to processing tool interface module that functions as a pass-through load lock, connecting a load lock chamber to an atmospheric processing chamber. This module is designed to facilitate seamless substrate transfer while maintaining environmental isolation. The interface module features substrate support shelves positioned beneath at least one closable opening, allowing substrates to be temporarily held during transfer operations. The closable opening ensures controlled access between the chambers, preventing contamination or pressure loss. The load lock chamber handles the transition between vacuum and atmospheric conditions, while the atmospheric processing chamber performs operations in a non-vacuum environment. The interface module's design optimizes throughput by reducing transfer time and minimizing exposure to uncontrolled environments. This solution is particularly useful in applications requiring precise substrate handling in multi-chamber processing systems.
8. The substrate processing tool of claim 7, wherein the substrate carrier to processing tool interface module is configured so that a substrate is transported through the pass-through load lock into the load lock chamber from the atmospheric processing chamber and for substrate exit into a vacuum environment of a substrate carrier coupled to the substrate carrier to processing tool interface module.
This invention relates to substrate processing tools, specifically systems for transferring substrates between atmospheric and vacuum environments. The problem addressed is the need for efficient and contamination-free substrate transport between different processing chambers, particularly when transitioning from atmospheric to vacuum conditions. The system includes a substrate carrier to processing tool interface module that facilitates substrate movement through a pass-through load lock. The pass-through load lock allows substrates to be transferred from an atmospheric processing chamber into a load lock chamber, and then into a vacuum environment of a substrate carrier connected to the interface module. This design ensures controlled transitions between different pressure environments, minimizing contamination and improving processing efficiency. The interface module is configured to handle bidirectional substrate transport, enabling seamless integration with both atmospheric and vacuum processing systems. The pass-through load lock acts as an intermediary, allowing substrates to be loaded or unloaded while maintaining environmental isolation. This setup is particularly useful in semiconductor manufacturing, where precise control of substrate handling is critical to yield and quality. The invention improves upon existing substrate processing tools by providing a more streamlined and reliable method for transferring substrates between chambers with different pressure conditions, reducing the risk of contamination and enhancing overall system performance.
9. The substrate processing tool of claim 1, wherein the atmospheric processing chamber is an equipment front end module having a back connected to the load lock chamber, a BOLTS interface opposite the back and sides extending between the BOLTS interface and the back, the substrate carrier to processing tool interface module being coupled to one of the back, sides and BOLTS interface.
This invention relates to substrate processing tools, specifically an atmospheric processing chamber integrated with a load lock chamber. The system addresses the challenge of efficiently transferring substrates between atmospheric and vacuum environments in semiconductor or similar manufacturing processes. The atmospheric processing chamber is designed as an equipment front end module (EFEM) with a back side connected to the load lock chamber, a BOLTS (Buffer Oriented Lateral Transfer System) interface on the opposite side, and side walls extending between them. The module includes a substrate carrier to processing tool interface module, which can be coupled to either the back, sides, or BOLTS interface. This modular design allows flexible integration of substrate handling systems, enabling efficient substrate transfer and processing. The BOLTS interface facilitates standardized connections with other equipment, while the load lock chamber maintains controlled transitions between atmospheric and vacuum conditions. The system improves throughput and reliability in substrate processing operations by optimizing the interface between different processing and handling modules.
11. The substrate processing tool of claim 10, wherein the substrate carrier to processing tool interface module is connected to the load lock.
A substrate processing tool is designed for handling and processing semiconductor substrates, such as wafers, in a controlled environment. The tool includes a substrate carrier interface module that facilitates the transfer of substrates between a substrate carrier and the processing tool. This interface module is directly connected to a load lock, which serves as an airlock between the external environment and the processing chamber. The load lock ensures that substrates are transferred into the processing tool without exposing them to contaminants or atmospheric conditions that could degrade their quality. The interface module may include mechanisms for aligning, securing, or positioning the substrate carrier to ensure precise and reliable transfer. The load lock may incorporate vacuum systems, sealing mechanisms, or environmental controls to maintain the required conditions during substrate transfer. This design improves efficiency and reduces contamination risks in semiconductor manufacturing processes.
12. The substrate processing tool of claim 10, wherein the atmospheric processing chamber comprises a mini-environment wherein the substrate carrier to processing tool interface module is connected to the mini-environment.
This invention relates to substrate processing tools, specifically addressing challenges in maintaining clean and controlled environments during substrate handling. The system includes an atmospheric processing chamber designed as a mini-environment to minimize contamination risks. The mini-environment is connected to a substrate carrier-to-processing tool interface module, which facilitates the transfer of substrates between the carrier and the processing tool while maintaining environmental integrity. The mini-environment is isolated from external contaminants, ensuring that substrates are processed in a controlled atmosphere. The interface module may include mechanisms for aligning, securing, or transferring substrates, ensuring precise and contamination-free handling. The system is particularly useful in semiconductor manufacturing, where cleanliness and precision are critical. By integrating the mini-environment with the interface module, the invention reduces the risk of particle contamination and improves process yield. The design allows for seamless substrate transfer while maintaining the required environmental conditions, enhancing overall manufacturing efficiency and reliability.
13. The substrate processing tool of claim 10, wherein the atmospheric processing chamber comprises a mini-environment where the substrate carrier to processing tool interface module is connected to both the load lock and the mini-environment.
This invention relates to substrate processing tools, specifically those used in semiconductor or similar manufacturing environments. The problem addressed is the need for efficient and contamination-controlled transfer of substrates between a substrate carrier and a processing tool, particularly in systems where substrates must move between different pressure environments, such as atmospheric and vacuum conditions. The invention describes a substrate processing tool with an atmospheric processing chamber that includes a mini-environment. This mini-environment is a controlled, isolated space designed to minimize contamination during substrate handling. The mini-environment is connected to both a load lock and a substrate carrier-to-processing tool interface module. The load lock is a chamber that allows substrates to transition between atmospheric and vacuum conditions without exposing them to external contaminants. The interface module facilitates the transfer of substrates between the substrate carrier and the processing tool while maintaining environmental control. The mini-environment ensures that the substrate remains in a clean, controlled atmosphere during transfer, reducing the risk of particle contamination or oxidation. This design is particularly useful in semiconductor manufacturing, where even minor contamination can degrade device performance. The system improves throughput and yield by streamlining the transfer process while maintaining high cleanliness standards. The invention is part of a broader system that may include additional modules for substrate handling, processing, and environmental control.
14. The substrate processing tool of claim 10, wherein the substrate carrier to processing tool interface module is configured to evacuate or charge a substrate carrier fluidic barrier seal located between a door of the substrate carrier and a housing of the substrate carrier.
This invention relates to substrate processing tools, specifically focusing on the interface between a substrate carrier and a processing tool. The problem addressed is ensuring a reliable seal between the substrate carrier and the processing tool during substrate transfer, which is critical for maintaining cleanroom conditions and preventing contamination. The invention includes a substrate carrier to processing tool interface module that manages the fluidic barrier seal between the substrate carrier door and the carrier housing. This module is designed to either evacuate or charge the seal, depending on operational requirements. Evacuating the seal creates a vacuum, which can help in securely locking the door or ensuring a tight seal. Charging the seal, on the other hand, may involve pressurizing it to facilitate door opening or to adjust the seal's flexibility for better alignment. The interface module may also include a docking mechanism to align and secure the substrate carrier to the processing tool, ensuring precise positioning for substrate transfer. Additionally, the module may incorporate a door opening mechanism to automate the process of opening and closing the carrier door, reducing manual intervention and improving efficiency. The invention aims to enhance the reliability and efficiency of substrate handling in semiconductor or similar manufacturing environments by improving the sealing and docking mechanisms between the carrier and the processing tool. This reduces the risk of contamination and improves throughput in automated production lines.
15. The substrate processing tool of claim 10, wherein the substrate carrier to processing tool interface module is configured to evacuate or charge an internal environment of the substrate carrier.
A substrate processing tool is designed to handle and process substrates, such as semiconductor wafers, in a controlled environment. The tool includes a substrate carrier interface module that connects the substrate carrier to the processing tool. This interface module is specifically configured to modify the internal environment of the substrate carrier by either evacuating or charging it. Evacuation removes gases or contaminants from the carrier, while charging introduces a controlled gas or pressure to maintain or alter the internal conditions. This functionality ensures that the substrate remains in a stable and contamination-free state during transfer between the carrier and the processing tool, improving yield and reliability in semiconductor manufacturing. The interface module may include valves, pumps, or other mechanisms to regulate the internal environment, ensuring compatibility with various substrate types and processing requirements. The system enhances process control by preventing external contamination and maintaining optimal conditions for subsequent processing steps.
16. The substrate processing tool of claim 10, wherein the substrate carrier to processing tool interface module is configured to form a pass-through load lock connected to the load lock chamber and the atmospheric processing chamber, the substrate carrier to processing tool interface module having substrate support shelves disposed underneath one of the at least one closable opening.
This invention relates to substrate processing tools, specifically addressing the challenge of efficiently transferring substrates between atmospheric and vacuum environments in semiconductor or similar manufacturing processes. The system includes a substrate carrier to processing tool interface module that acts as a pass-through load lock, connecting a load lock chamber to an atmospheric processing chamber. This module is designed to facilitate seamless substrate transfer while maintaining environmental isolation. The interface module features substrate support shelves positioned beneath at least one closable opening, allowing substrates to be temporarily held during transfer operations. The closable opening ensures controlled access between the chambers, preventing contamination or pressure loss. The load lock chamber handles vacuum conditions, while the atmospheric processing chamber operates at ambient pressure, enabling diverse processing steps without compromising substrate integrity. The system optimizes throughput by reducing transfer time and minimizing exposure to atmospheric conditions, which is critical for sensitive materials. The substrate support shelves provide stable positioning during transitions, enhancing reliability. This design improves efficiency in manufacturing workflows requiring multiple processing environments.
17. The substrate processing tool of claim 16, wherein the substrate carrier to processing tool interface module is configured so that a substrate is transported through the pass-through load lock into the load lock chamber from the atmospheric processing chamber and for substrate exit into a vacuum environment of a substrate carrier coupled to the substrate carrier to processing tool interface module.
This invention relates to substrate processing tools, specifically systems for transferring substrates between atmospheric and vacuum environments. The problem addressed is the need for efficient and contamination-free substrate transport between different processing chambers, particularly when transitioning from an atmospheric environment to a vacuum environment. The system includes a substrate carrier to processing tool interface module that facilitates substrate transfer. A pass-through load lock is used to move substrates from an atmospheric processing chamber into a load lock chamber. The interface module is designed to allow substrates to exit the load lock chamber and enter a vacuum environment of a substrate carrier connected to the module. This ensures controlled and isolated transport, minimizing exposure to contaminants during the transition. The system may also include additional features such as alignment mechanisms, sealing systems, and environmental controls to maintain substrate integrity during transfer. The invention improves substrate handling efficiency and reduces contamination risks in semiconductor or similar manufacturing processes.
18. The substrate processing tool of claim 10, wherein the atmospheric processing chamber is an equipment front end module having a back connected to the load lock chamber, a BOLTS interface opposite the back and sides extending between the BOLTS interface and the back, the substrate carrier to processing tool interface module being coupled to one of the back, sides and BOLTS interface.
This invention relates to substrate processing tools, specifically focusing on the integration of an atmospheric processing chamber with a load lock chamber in semiconductor manufacturing. The problem addressed is the efficient transfer and processing of substrates between atmospheric and vacuum environments while maintaining cleanliness and minimizing contamination. The substrate processing tool includes an atmospheric processing chamber designed as an equipment front end module (EFEM). This module has a back side connected to a load lock chamber, a BOLTS (Buffer Oriented Logistics Transfer System) interface on the opposite side, and sides extending between the BOLTS interface and the back. The EFEM is configured to interface with a substrate carrier to processing tool interface module, which can be coupled to either the back, sides, or BOLTS interface of the EFEM. This modular design allows for flexible integration with different substrate handling systems, improving adaptability and throughput in semiconductor fabrication processes. The system ensures controlled substrate transfer between atmospheric and vacuum environments, reducing contamination risks and enhancing processing efficiency.
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May 23, 2023
May 7, 2024
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