The disclosure relates to a method for tuning stress transitions of films on a substrate. The method includes forming a stress-adjustment layer on the substrate, wherein the stress-adjustment layer includes first regions formed of a first material and second regions formed of a second material, wherein the first material includes a first internal stress and the second material includes a second internal stress, and wherein the first internal stress is different compared to the second internal stress; and forming transition regions between the first regions and the second regions, wherein the transition regions include an interface between the first material and the second material that has a predetermined slope that is greater than zero degrees and less than 90 degrees.
Legal claims defining the scope of protection, as filed with the USPTO.
4. The method of claim 3, wherein the first material has a different internal stress as compared to the third material.
5. The method of claim 1, wherein changing the solubility of the second layer includes creating a second transition region defining a second predetermined vertical acid diffusion length across the second transition region.
8. The method of claim 1, wherein creating the transition region defining the predetermined vertical acid diffusion length is based on a desired stress transition for the transition region.
10. The method of claim 1, wherein the predetermined physical slope is selected based on a design stress transition.
13. The method of claim 12, further comprising forming transition regions of different interface physical slopes based on a coordinate location on the substrate.
15. The method of claim 12, wherein the first internal stress is a compressive stress, and the second internal stress is a tensile stress.
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July 7, 2020
May 21, 2024
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