Embodiments that allow multi-chip interconnect using organic bridges are described. In some embodiments an organic package substrate has an embedded organic bridge. The organic bridge can have interconnect structures that allow attachment of die to be interconnected by the organic bridge. In some embodiments, the organic bridge comprises a metal routing layer, a metal pad layer and interleaved organic polymer dielectric layers but without a substrate layer. Embodiments having only a few layers may be embedded into the top layer or top few layers of the organic package substrate. Methods of manufacture are also described.
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2. The microelectronic package of claim 1, wherein the organic polymer interconnect bridge includes one or more spin-on-glass dielectric layers.
The invention relates to microelectronic packaging, specifically addressing challenges in interconnect structures for advanced semiconductor devices. Traditional interconnect bridges in microelectronic packages often suffer from reliability issues, thermal mismatches, and limited electrical performance due to material constraints. This invention improves upon prior designs by incorporating an organic polymer interconnect bridge with enhanced structural and electrical properties. The organic polymer interconnect bridge serves as a conductive pathway between microelectronic components, replacing or supplementing conventional metal interconnects. To enhance insulation and performance, the bridge includes one or more spin-on-glass (SOG) dielectric layers. SOG layers are applied as liquid precursors that solidify into a glass-like material, providing excellent dielectric properties, thermal stability, and compatibility with organic polymers. These layers prevent electrical crosstalk, reduce signal loss, and improve thermal management within the package. The organic polymer bridge itself offers flexibility, lightweight construction, and cost-effective manufacturing compared to rigid inorganic materials. By integrating SOG dielectric layers, the bridge achieves superior insulation while maintaining mechanical robustness. This combination is particularly useful in high-density interconnect applications, where minimizing signal interference and thermal stress is critical. The invention enables more reliable and efficient microelectronic packages for advanced computing, memory, and communication devices.
3. The microelectronic package of claim 1, wherein the organic polymer interconnect bridge includes multiple conductor layers.
The invention relates to microelectronic packaging, specifically addressing the challenge of interconnecting multiple microelectronic components with improved electrical performance and reliability. The microelectronic package includes an organic polymer interconnect bridge that provides electrical connections between components. This bridge is designed to enhance signal integrity and thermal management while maintaining structural integrity under mechanical stress. The interconnect bridge features multiple conductor layers, which allow for increased signal density, reduced signal loss, and better thermal dissipation compared to single-layer designs. These conductor layers are embedded within the organic polymer material, which provides flexibility and mechanical stability. The multiple conductor layers enable complex routing of electrical signals, supporting high-speed data transmission and power distribution across the package. The organic polymer material also acts as an insulating layer between the conductor layers, preventing short circuits while maintaining thermal conductivity. This design is particularly useful in advanced packaging applications where space constraints and performance demands are critical, such as in high-performance computing, telecommunications, and automotive electronics. The use of multiple conductor layers in the interconnect bridge improves overall package efficiency and reliability, addressing limitations of traditional single-layer interconnects.
4. The microelectronic package of claim 1, wherein a wire width in the organic polymer interconnect bridge is 3 μm or less.
The invention relates to microelectronic packaging, specifically addressing the challenge of achieving fine-pitch interconnects in organic polymer-based interconnect bridges. Traditional microelectronic packages often struggle with signal integrity and thermal management when using organic polymers for interconnects, particularly at smaller feature sizes. This invention improves upon prior designs by incorporating an organic polymer interconnect bridge with a wire width of 3 micrometers or less. The interconnect bridge provides electrical connections between multiple microelectronic components, such as integrated circuits or substrates, while maintaining high signal integrity and thermal performance. The narrow wire width enables higher-density interconnects, reducing package size and improving performance in high-speed applications. The organic polymer material used in the bridge offers flexibility and cost advantages compared to traditional inorganic materials, while the fine-pitch design ensures compatibility with advanced semiconductor packaging requirements. This solution is particularly useful in applications requiring compact, high-performance microelectronic packages, such as mobile devices, data centers, and high-frequency communication systems. The invention enhances interconnect density without sacrificing reliability or thermal efficiency, addressing key limitations in existing microelectronic packaging technologies.
5. The microelectronic package of claim 1, wherein a wire width in the organic polymer interconnect bridge includes a region of 3 μm or less width and a region of 10 μm or less width.
This invention relates to microelectronic packaging, specifically an organic polymer interconnect bridge used to connect separate microelectronic components. The technology addresses challenges in high-density interconnects, such as signal integrity, thermal management, and mechanical reliability, by optimizing the design of the interconnect bridge. The microelectronic package includes an organic polymer interconnect bridge that electrically connects two or more microelectronic components. The bridge features a variable wire width design, with at least one region having a width of 3 micrometers or less and another region having a width of 10 micrometers or less. This dual-width structure allows for fine-pitch connections in high-density areas while maintaining structural integrity in wider sections. The organic polymer material provides flexibility and thermal stability, reducing stress and improving reliability in high-performance applications. The interconnect bridge may also include conductive traces embedded within the polymer, ensuring efficient signal transmission. The design enables compact packaging while supporting high-speed data transfer and power distribution. The variable width regions optimize electrical performance and thermal dissipation, addressing limitations in traditional rigid interconnects. This solution is particularly useful in advanced semiconductor packaging, where miniaturization and reliability are critical.
6. The microelectronic package of claim 1, wherein the organic polymer interconnect bridge is 15 μm or less in thickness.
The invention relates to microelectronic packaging, specifically addressing the challenge of achieving high-density interconnects in compact electronic devices. Traditional interconnect structures often suffer from limitations in miniaturization, thermal management, and signal integrity due to thicker organic polymer layers. This invention improves upon prior art by incorporating an organic polymer interconnect bridge with a reduced thickness of 15 micrometers or less. The interconnect bridge provides electrical and thermal connectivity between microelectronic components while minimizing signal loss and thermal resistance. The thin organic polymer layer enables finer pitch interconnects, supporting higher-density packaging configurations. Additionally, the reduced thickness enhances thermal dissipation, reducing the risk of overheating in high-performance applications. The interconnect bridge may be integrated into a microelectronic package that includes a substrate, semiconductor dies, and other passive or active components, ensuring reliable signal transmission and mechanical stability. The invention is particularly useful in advanced semiconductor packaging, such as fan-out wafer-level packaging (FOWLP) or system-in-package (SiP) designs, where space constraints and performance demands are critical. By optimizing the thickness of the organic polymer interconnect bridge, the invention enables more efficient and compact microelectronic packaging solutions.
8. The microelectronic package of claim 7, wherein the organic polymer interconnect bridge is incorporated into a solder mask cavity on a surface layer of the substrate.
This invention relates to microelectronic packaging, specifically addressing challenges in interconnecting components within a microelectronic package. The technology focuses on improving electrical and thermal connectivity while maintaining structural integrity and reliability in high-density electronic assemblies. The invention features a microelectronic package with an organic polymer interconnect bridge embedded within a solder mask cavity on a surface layer of the substrate. The interconnect bridge provides a conductive pathway between electronic components, enhancing signal transmission and thermal dissipation. The solder mask cavity ensures precise alignment and mechanical stability, preventing misalignment or damage during assembly. The organic polymer material offers flexibility and durability, accommodating thermal expansion and mechanical stress without degradation. This design is particularly useful in advanced packaging applications where high-performance interconnects are required, such as in integrated circuits, system-in-package (SiP) modules, and high-density interconnect (HDI) substrates. The embedded interconnect bridge improves manufacturing yield and long-term reliability by reducing defects and ensuring consistent electrical performance. The solution addresses limitations in traditional interconnect methods, such as wire bonding or solder joints, by providing a more robust and scalable alternative.
9. The microelectronic package of claim 7, wherein the organic polymer interconnect bridge includes one or more spin-on-glass dielectric layers.
The invention relates to microelectronic packaging, specifically addressing challenges in interconnecting microelectronic components using organic polymer interconnect bridges. These bridges are used to provide electrical and/or thermal connections between microelectronic components, such as integrated circuits, within a package. A key issue in such systems is ensuring reliable insulation and structural integrity while maintaining high-performance electrical connections. The invention improves upon prior art by incorporating one or more spin-on-glass (SOG) dielectric layers within the organic polymer interconnect bridge. Spin-on-glass is a material applied in liquid form and then cured to form a solid dielectric layer, offering excellent insulating properties and planarization capabilities. By integrating SOG layers into the polymer bridge, the invention enhances electrical insulation, reduces signal interference, and improves thermal management. The SOG layers also help in achieving precise thickness control and uniform deposition, which are critical for high-density interconnect applications. Additionally, the combination of organic polymers with SOG layers provides flexibility in design while maintaining mechanical stability. This approach is particularly useful in advanced packaging technologies where miniaturization and performance are key requirements. The invention thus addresses the need for reliable, high-performance interconnect solutions in modern microelectronic systems.
10. The microelectronic package of claim 7, wherein the organic polymer interconnect bridge includes multiple conductor layers.
The invention relates to microelectronic packaging, specifically addressing the challenge of interconnecting multiple microelectronic components with improved electrical performance and reliability. Traditional interconnect structures often suffer from signal integrity issues, thermal mismatches, and mechanical stress, which can degrade performance over time. This invention introduces an organic polymer interconnect bridge that enhances connectivity between microelectronic components while mitigating these problems. The organic polymer interconnect bridge is designed to provide a flexible and durable connection between components, reducing mechanical stress and improving thermal stability. A key feature of this bridge is the inclusion of multiple conductor layers, which allows for higher density interconnects and better signal routing. These conductor layers are embedded within the organic polymer material, which acts as an insulating and structural support layer. The multiple conductor layers enable complex wiring patterns, supporting high-speed data transmission and power distribution with minimal signal loss. The organic polymer material is selected for its compatibility with microelectronic fabrication processes, ensuring ease of integration into existing packaging technologies. The bridge can be used in various applications, including advanced semiconductor packages, system-in-package (SiP) designs, and high-performance computing modules. By incorporating multiple conductor layers, the interconnect bridge improves electrical performance while maintaining mechanical robustness, addressing the limitations of conventional interconnect solutions.
11. The microelectronic package of claim 7, wherein a wire width in the organic polymer interconnect bridge is 3 μm or less.
The invention relates to microelectronic packaging, specifically addressing the challenge of achieving fine-pitch interconnects in organic polymer-based interconnect bridges. Traditional microelectronic packages often struggle with signal integrity and thermal management when using wider wire widths, which can limit performance in high-density applications. This invention improves upon prior designs by incorporating an organic polymer interconnect bridge with a wire width of 3 micrometers or less. The organic polymer material provides flexibility and thermal stability, while the reduced wire width enables higher interconnect density, improved signal integrity, and better thermal dissipation. The interconnect bridge is designed to connect multiple microelectronic components, such as integrated circuits or semiconductor dies, within a single package. The fine-pitch wiring allows for more compact packaging solutions, which is particularly beneficial for advanced computing, memory, and RF applications. The invention also ensures reliable electrical connections while maintaining mechanical robustness, addressing common issues in high-performance microelectronic systems.
12. The microelectronic package of claim 7, wherein a wire width in the organic polymer interconnect bridge includes a region of 3 μm or less width and a region of 10 μm or less width.
The invention relates to microelectronic packaging, specifically addressing challenges in interconnect design for high-density and high-performance electronic devices. Traditional interconnect structures often face limitations in signal integrity, thermal management, and manufacturing complexity, particularly when integrating different materials and components. This invention improves upon prior art by incorporating an organic polymer interconnect bridge with optimized wire width regions to enhance electrical performance and reliability. The microelectronic package includes an organic polymer interconnect bridge that connects multiple microelectronic components. The bridge features a wire width design with at least two distinct regions: one region has a width of 3 micrometers or less, while another region has a width of 10 micrometers or less. This dual-width configuration allows for fine-pitch connections in high-density areas while maintaining structural integrity and signal integrity in broader sections. The organic polymer material provides flexibility and thermal stability, reducing stress and improving reliability in advanced packaging applications. The design is particularly useful in applications requiring high-speed signal transmission and compact form factors, such as in advanced computing, telecommunications, and semiconductor devices.
14. The microelectronic package of claim 13, further including a bonding layer between the organic polymer interconnect bridge and the substrate.
The invention relates to microelectronic packaging, specifically addressing challenges in connecting microelectronic components using organic polymer interconnect bridges. Traditional packaging methods often suffer from poor electrical or thermal conductivity, mechanical instability, or reliability issues when integrating different materials. This invention improves upon prior art by incorporating a bonding layer between an organic polymer interconnect bridge and a substrate. The bonding layer enhances adhesion, thermal management, and electrical performance while ensuring structural integrity. The organic polymer interconnect bridge provides flexible, lightweight, and cost-effective connections between microelectronic components, while the bonding layer mitigates stress, prevents delamination, and improves heat dissipation. The substrate may be a semiconductor wafer, printed circuit board, or other microelectronic base material. The bonding layer can be composed of conductive or insulating materials, depending on the application, and may include adhesives, solder, or other bonding agents. This configuration enables reliable high-density interconnects in advanced packaging solutions, such as chip-to-chip or chip-to-board connections, while maintaining mechanical robustness and thermal stability. The invention is particularly useful in applications requiring high-performance, compact, and scalable microelectronic packaging.
15. The microelectronic package of claim 13, wherein the organic polymer interconnect bridge includes one or more spin-on-glass dielectric layers.
The invention relates to microelectronic packaging, specifically addressing challenges in interconnect structures that bridge between semiconductor dies or other components. Traditional interconnects often suffer from reliability issues, thermal mismatches, or manufacturing complexities. This invention improves upon prior designs by incorporating an organic polymer interconnect bridge that enhances electrical and thermal performance while simplifying fabrication. The organic polymer interconnect bridge is a flexible, electrically conductive structure that connects microelectronic components, such as semiconductor dies, within a package. It is designed to accommodate thermal expansion mismatches between different materials, reducing stress and improving long-term reliability. The bridge includes conductive pathways embedded within an organic polymer matrix, which provides mechanical flexibility and thermal stability. A key feature of this invention is the inclusion of one or more spin-on-glass (SOG) dielectric layers within the organic polymer interconnect bridge. SOG layers are applied as a liquid and then cured to form a solid dielectric material, offering precise thickness control and excellent insulating properties. These layers electrically isolate the conductive pathways while maintaining structural integrity. The combination of organic polymers and SOG layers allows for fine-tuned electrical performance, reduced signal interference, and improved thermal management. This design is particularly useful in advanced packaging applications where high-density interconnects are required, such as in 3D integrated circuits or multi-chip modules. The use of SOG layers enhances manufacturability and reliability, making the interconnect bridge suitable for high-performance
16. The microelectronic package of claim 13, wherein the organic polymer interconnect bridge includes multiple conductor layers.
The invention relates to microelectronic packaging, specifically addressing the challenge of improving electrical connectivity and structural integrity in microelectronic packages. The package includes an organic polymer interconnect bridge that provides electrical and mechanical connections between components. This bridge is designed to enhance reliability and performance by reducing signal loss and mechanical stress. The bridge comprises multiple conductor layers, which allow for increased signal routing density and improved thermal management. These layers are embedded within an organic polymer matrix, ensuring flexibility and durability while maintaining high electrical conductivity. The multiple conductor layers enable complex interconnections between microelectronic components, such as chips, substrates, or other electronic elements, without compromising package integrity. This design is particularly useful in high-performance computing, telecommunications, and other applications requiring robust and efficient interconnect solutions. The use of organic polymers ensures compatibility with existing manufacturing processes while offering superior mechanical properties compared to traditional inorganic materials. The invention aims to solve issues related to signal integrity, thermal dissipation, and mechanical reliability in advanced microelectronic packaging.
17. The microelectronic package of claim 13, wherein a wire width in the organic polymer interconnect bridge is 3 μm or less.
This invention relates to microelectronic packaging, specifically addressing the challenge of achieving fine-pitch interconnects in organic polymer-based interconnect bridges. The technology involves a microelectronic package with an organic polymer interconnect bridge that connects a first microelectronic component to a second microelectronic component. The interconnect bridge includes a plurality of conductive wires embedded within an organic polymer material, where the wires are arranged in a staggered or offset pattern to reduce electrical interference and improve signal integrity. The package also includes a first interconnect structure attached to the first microelectronic component and a second interconnect structure attached to the second microelectronic component, with the organic polymer interconnect bridge electrically and mechanically coupling these structures. The conductive wires in the bridge have a width of 3 micrometers or less, enabling high-density interconnects for advanced microelectronic applications. The organic polymer material provides flexibility and thermal stability, while the fine-pitch wiring supports high-performance signal transmission. This design is particularly useful in applications requiring compact, high-speed interconnects, such as in advanced semiconductor devices and system-in-package (SiP) configurations.
18. The microelectronic package of claim 13, wherein a wire width in the organic polymer interconnect bridge includes a region of 3 μm or less width and a region of 10 μm or less width.
This invention relates to microelectronic packaging, specifically an organic polymer interconnect bridge used to connect separate microelectronic components. The bridge addresses challenges in high-density interconnects, such as signal integrity and thermal management, by incorporating varying wire widths to optimize electrical and thermal performance. The bridge includes at least two distinct regions with different wire widths: one region has a width of 3 micrometers or less, while another has a width of 10 micrometers or less. These width variations allow for fine-pitch connections in high-density applications while maintaining structural integrity and reducing signal loss. The organic polymer material provides flexibility and thermal stability, making it suitable for advanced packaging technologies. The interconnect bridge may also include conductive traces embedded within the polymer, ensuring reliable electrical connections between components. This design enables compact, high-performance microelectronic packages for applications in computing, telecommunications, and other electronics requiring dense interconnects.
19. The microelectronic package of claim 13, wherein the organic polymer interconnect bridge is 15 μm or less in thickness.
The invention relates to microelectronic packaging, specifically addressing the challenge of creating compact, high-performance interconnect structures in microelectronic devices. Traditional interconnect bridges in microelectronic packages often suffer from excessive thickness, leading to larger package sizes and reduced efficiency. This invention improves upon prior designs by incorporating an organic polymer interconnect bridge with a thickness of 15 micrometers or less. The organic polymer material provides flexibility and reliability while maintaining electrical connectivity between components. The interconnect bridge is integrated into a microelectronic package that includes a substrate, a first microelectronic component, and a second microelectronic component. The bridge spans a gap between these components, ensuring signal transmission with minimal signal loss and reduced physical footprint. The thin organic polymer bridge enables tighter packaging densities, improved thermal management, and enhanced overall device performance. This design is particularly useful in advanced semiconductor applications where space constraints and performance demands are critical. The invention ensures robust electrical connections while maintaining structural integrity, addressing limitations of conventional interconnect technologies.
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June 1, 2020
June 4, 2024
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