Embodiments that allow multi-chip interconnect using organic bridges are described. In some embodiments an organic package substrate has an embedded organic bridge. The organic bridge can have interconnect structures that allow attachment of die to be interconnected by the organic bridge. In some embodiments, the organic bridge comprises a metal routing layer, a metal pad layer and interleaved organic polymer dielectric layers but without a substrate layer. Embodiments having only a few layers may be embedded into the top layer or top few layers of the organic package substrate. Methods of manufacture are also described.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The microelectronic package of claim 1, wherein the organic polymer interconnect bridge includes one or more spin-on-glass dielectric layers.
3. The microelectronic package of claim 1, wherein the organic polymer interconnect bridge includes multiple conductor layers.
4. The microelectronic package of claim 1, wherein a wire width in the organic polymer interconnect bridge is 3 μm or less.
5. The microelectronic package of claim 1, wherein a wire width in the organic polymer interconnect bridge includes a region of 3 μm or less width and a region of 10 μm or less width.
6. The microelectronic package of claim 1, wherein the organic polymer interconnect bridge is 15 μm or less in thickness.
8. The microelectronic package of claim 7, wherein the organic polymer interconnect bridge is incorporated into a solder mask cavity on a surface layer of the substrate.
9. The microelectronic package of claim 7, wherein the organic polymer interconnect bridge includes one or more spin-on-glass dielectric layers.
10. The microelectronic package of claim 7, wherein the organic polymer interconnect bridge includes multiple conductor layers.
11. The microelectronic package of claim 7, wherein a wire width in the organic polymer interconnect bridge is 3 μm or less.
12. The microelectronic package of claim 7, wherein a wire width in the organic polymer interconnect bridge includes a region of 3 μm or less width and a region of 10 μm or less width.
14. The microelectronic package of claim 13, further including a bonding layer between the organic polymer interconnect bridge and the substrate.
15. The microelectronic package of claim 13, wherein the organic polymer interconnect bridge includes one or more spin-on-glass dielectric layers.
16. The microelectronic package of claim 13, wherein the organic polymer interconnect bridge includes multiple conductor layers.
17. The microelectronic package of claim 13, wherein a wire width in the organic polymer interconnect bridge is 3 μm or less.
18. The microelectronic package of claim 13, wherein a wire width in the organic polymer interconnect bridge includes a region of 3 μm or less width and a region of 10 μm or less width.
19. The microelectronic package of claim 13, wherein the organic polymer interconnect bridge is 15 μm or less in thickness.
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June 1, 2020
June 4, 2024
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