A transferring unit, a substrate treating apparatus including the same, and a substrate treating method are provided. The substrate treating apparatus includes a support plate, a plurality of protrusions protruding upward from the support plate to support a substrate, a temperature adjusting member provided in the support plate to heat or cool the substrate, and an ultrasound applying member to apply an ultrasound between the substrate placed on the plurality of protrusions and the support plate.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The substrate treating apparatus of claim 1, wherein the temperature adjusting member is a cooling member configured to cool the substrate.
3. The substrate treating apparatus of claim 2, wherein the temperature adjusting member has a cooling fluid passage provided in the support plate.
4. The substrate treating apparatus of claim 1, wherein the temperature adjusting member is a heating member configured to heat the substrate.
5. The substrate treating apparatus of claim 1, wherein the ultrasound applying member is provided at one side portion of the support plate.
7. The substrate treating apparatus of claim 6, wherein the cooling unit is provided in the transferring plate.
8. The substrate treating apparatus of claim 7, wherein the cooling unit is a cooling fluid passage.
11. The transferring unit of claim 10, wherein the cooling unit is provided in the transferring plate.
12. The transferring unit of claim 10, wherein the cooling unit is a cooling fluid passage.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
November 6, 2020
June 4, 2024
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