According to one embodiment, a memory system includes a first plate, an intermediate member, and a substrate. The intermediate member includes a second plate and a pair of side walls. The second plate includes a first opening, and is arranged to have a gap with respect to the first plate. The second plate includes a first face facing the first plate and a second face located on a side opposite to the first face. The pair of side walls is arranged on the second face. The substrate is placed between the pair of side walls. The substrate includes a third face on which a first non-volatile memory package and a controller package are mounted. The third face faces the second plate. The first non-volatile memory package is thermally connected to the second plate. The controller package is thermally connected to the first plate through the first opening.
Legal claims defining the scope of protection, as filed with the USPTO.
3. The memory system according to claim 1, wherein the first plate includes a second opening provided at a position corresponding to the first non-volatile memory package.
4. The memory system according to claim 2, wherein the first plate includes a second opening provided at a position corresponding to the first non-volatile memory package.
15. The memory system according to claim 7, wherein the first non-volatile memory package and the second non-volatile memory package are mounted at positions corresponding to each other on the substrate.
16. The memory system according to claim 8, wherein the first non-volatile memory package and the second non-volatile memory package are mounted at positions corresponding to each other on the substrate.
17. The memory system according to claim 9, wherein the first non-volatile memory package and the second non-volatile memory package are mounted at positions corresponding to each other on the substrate.
18. The memory system according to claim 13, wherein the first non-volatile memory package and the second non-volatile memory package are mounted at positions corresponding to each other on the substrate.
19. The memory system according to claim 14, wherein the first non-volatile memory package and the second non-volatile memory package are mounted at positions corresponding to each other on the substrate.
20. The memory system according to claim 1, wherein the first non-volatile memory package is in contact with the second plate through a thermal conductive sheet, and the controller package is in contact with the first plate through a second thermal conductive sheet.
21. The memory system according to claim 1, wherein the gap separates a heat dissipation path of heat generated from the controller package and a heat dissipation path of heat generated from the first non-volatile memory package.
23. The memory system according to claim 22, further comprising a third plate that covers a fourth face of the substrate, the fourth face is on a side opposite to the third face.
25. The memory system according to claim 24, wherein the first non-volatile memory package and the second non-volatile memory package are mounted at positions corresponding to each other on the substrate.
28. The memory system according to claim 26, wherein the first non-volatile memory package and the second non-volatile memory package are mounted at positions corresponding to each other on the substrate.
29. The memory system according to claim 27, wherein the first non-volatile memory package and the second non-volatile memory package are mounted at positions corresponding to each other on the substrate.
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January 24, 2022
June 18, 2024
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