An aqueous alkaline chemical mechanical polishing composition includes a quaternary ammonium compound having a phenyl group which enables enhanced reduction of defects on silicon oxide substrates and enables good silicon oxide removal rates during chemical mechanical polishing.
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2. The method of chemical mechanical polishing a substrate of claim 1, wherein the quaternary ammonium compound has the following formula (I):, wherein R1, R2 and R3 are independently selected from the group consisting of C1-C2 alkyl and X− is selected from the group consisting of Br−, Cl− and OH−.
5. The method of claim 1, wherein the quaternary ammonium compound is selected from the group consisting of phenyltrimethylammonium chloride, phenyltrimethylammonium bromide, phenyltrimethylammonium hydroxide and mixtures thereof.
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October 13, 2022
July 2, 2024
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