Patentable/Patents/US-12033938
US-12033938

Semiconductor structures of anti-fuse devices and core devices with different dielectric layers and preparation method thereof

PublishedJuly 9, 2024
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

A preparation method of the semiconductor structure includes: providing a substrate including a core device region and an anti-fuse device region; forming a first dielectric layer covering the core device region and the anti-fuse device region; forming a second dielectric layer covering the first dielectric layer and having a dielectric constant larger than a dielectric constant of the first dielectric layer; removing the second dielectric layer on the anti-fuse device region; and forming a conductive layer covering the first dielectric layer on the anti-fuse device region and the second dielectric layer on the core device region.

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Patent Metadata

Filing Date

September 2, 2021

Publication Date

July 9, 2024

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